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The reliability of high rock-fill dam slope is a complex systematic reliability analysis, which is one of the core and difficult technological problems in dam design. Based on the deterministic finite element method, the system reliability analysis method of high rock-fill dam slope stability using nonlinear indexes is proposed here by integrating strength reduction method, response surface method,...
Taking multiple parameters of the main structural plates thicknesses and loads as random design variables, the strength reliability of bogie frame is analyzed based on response surface optimization approach and JC method. The response surface optimization approach is used to search the failure points of the structure limit state. Meanwhile, the sensitivity of structure reliability is also analyzed...
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25°C) and elevated temperature...
According to the Pro/Mechanica analysis platform, by the finite element analysis method, the actual mold honeycomb molded forces, boundary conditions and imposed load in the view of the molded honeycomb mold for the actual operating conditions leading to die due to stress concentration fatigue failure, the reliability of the problem of insufficient. Through the analysis to determine the maximum stress...
This paper presents a method mining the worst thermal fatigue life of solder joints on chip components used in vehicle electronics. Thermal fatigue life of crack initiation and propagation were calculated by using the finite element method. Statistical analysis of thermal fatigue life in the solder layer below the chip component was carried out. A sample of dispersed fatigue lives was generated by...
In December 2007, the Army Acquisition Executive approved the new Army Reliability Policy. The policy was developed to cost-effectively increase the reliability of Army systems. The new policy encourages use of cost-effective reliability best practices and provides a mechanism to alert key Army leaders when weapon systems are off track with respect to meeting their reliability requirements. One of...
Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with finite-element (FE) simulations. The reliability tests were composed of the thermal shock test, the local thermal cycling test (resistors embedded in the board around the package), and the power cycling test (heat generation in the die). A 3-D board-level...
Reliability of microfluidic designs is an extremely important issue that defines the range of applicability of micro-devices. The reliability design of micro-channels presents new complications that require extensions of today's method to incorporate reliable prediction methodologies. In this paper, using the improved direct simulation Monte Carlo, a prediction method was proposed for the reliability...
Miniaturisation of electronic devices and the RoHS directive have made the use of solder joints challenging. Thus, new methods for attachment of chips have been developed, such as adhesive attachments. Moisture is the principal cause for failures in these attachments. The effects of moisture to non-conductive adhesive attachments were studied by modeling with finite element method and by environmental...
The interface crack caused by moisture absorption is a main reason for the failure of plastic packaging electronic devices. According to the failure of interface cracks in QFN plastic packaging devices caused by hygro-thermal environment, the paper combining with finite element method (FEM), carried on the research by moisture absorption experiment, lead-free reflow soldering experiment, high temperature...
With the extensive use of Pb-free solder in electronic assemblies, there is a growing concern about the reliability of the solder joint. The need to identify the capability of high speed shear, to reveal brittle fracture failures, was the driving force behind this study. Shearing of 0603 resistors mounted on a PCB with Pb-free solder was considered as the test process setup for modeling and experimentation...
In this study, a new packaging technology, chip-on-metal (COM) panel level package (PLP), is proposed to resolve the problem of assembling a fine-pitched chip to a coarse-pitched substrate. During the manufacturing process, the filler polymer material is selected to fill the trench around the chip and provide a smooth surface for the redistribution lines. Therefore, the solder bumps could be located...
Due to size reduction in die manufacturing and introduction of brittle dielectric materials, crack related failures occur currently, mainly in interconnect levels. By means of Finite Element (FE) simulations, an energy based failure criterion named Nodal Release Energy (NRE) Method, inspired by the so-called Area Release Energy (ARE) one developed by Philips Applied Technologies, is used to numerically...
The methodology proposed in this paper is illustrated for a particular failure mode that was observed in a recently developed product during accelerated life testing (ALT). The probabilistic simulation methodology applied in this paper is used to predict and improve the survivability of the product under repeated drop testing. The failure mode encountered is the cracking of magnesium housing under...
The coefficient of thermal expansion (CTE) mismatch between silicon and organic printed circuit board (PCB) causes a reliability issue for the ball grid array type electronic package. This makes it difficult for the conventional wafer level chip scaled packaging (WLCSP) with large die to satisfy the reliability requirement. Therefore, in this study a novel solder joint protection-WLCSP (SJP-WLCSP)...
Passivation cracking is one of the main failures of integrated circuits (ICs) and thermo-mechanical failures are the root cause. A major cause for these failures is due to the mismatch of thermal and mechanical parameters while manufacturing or working, especially stress concentration at the interface and the edge. The ICs for different fixing position endure different thermal cycles, overload and...
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