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This paper reports a novel, low-cost and inherently simple vertical signal transmission method for glass-silicon-glass sandwich micro-electro-mechanical systems (MEMS) gyroscopes based on heavily doped silicon-bridge. As for the fabrication technique, only glass-to-silicon anodic bonding and after-laser-trimming process are needed, which are fully compatible with standard MEMS technology. Micro gyroscopes...
We present a new type of acoustic resonator technology aimed to undoing the technological locks encountered during the realization of capacitive silicon MEMS resonators exploiting true Bulk Acoustic Wave resonances instead of structural ones. The single-crystal silicon resonators are driven through a combination of a static bias and dynamic voltage applied across a 700 nm-thick electrostatic gap parallel...
This paper demonstrates a novel physical failure analysis (PFA) solution of MEMS motion sensor to inspect the fusion bonding interface between MEMS motion sensor proof-mass and oxide layer to locate defect points. This analytical study shows successful etching solution removal of MEMS motion sensor proof-mass and inspection of defect points.
Nanowires have attracted considerable interest as the nanoscale interconnects and as the moving elements of both electronic and electromechanical devices. The evaluation of nanomechanical property plays a significant role in the development of new nanowire-based devices. Recently, we are engaged in developing an easy method for nanomechanical measurement by using an in-plane-mode piezoresistive vibration...
This paper reports experimental results of a novel room temperature vacuum sealing process based on compressing wire bonded gold “bumps”, causing a material flow into the access ports of vacuum-cavities. The leak rate out of manufactured cavities was measured over 5 days and evaluated to less than the detection limit, 6×10−12 mbarL/s, per sealed port. The cavities have been sealed at a vacuum level...
In this paper, we demonstrated the detailed fabrication process of taper hollow metallic microneedle array through 2-layer SU-8 thick photoresist based backside exposure and Nickel electroplating techniques. We got microneedles with length in the range of 300 μm to 450 μm, and sharp tips with cone angles in the range of 4.6° to 5.7°. It was found that backside exposure through transparent glass substrate...
Most MEMS microphone systems on the market are packaged by conventional chip bonding and wire bonding.. A significant step towards miniaturization was achieved earlier by applying flip-chip bonding to MEMS microphone packaging. This technology is called chip scale MEMS package (CSMP). Thereby the package size could be reduced to 2.8 ?? 2.05 ?? 0.9 mm3 compared to a standard size of 3.76 ?? 2.95 ??...
The paper describes the development of a microassembly station for mounting MEMS components on a flexible substrate. The core components are a micro hotplate mounted on a xy stage and a suction gripper with an integrated force sensor carried by a nanoslider (1DOF in z-Axis). A syringe with a 30 gauge needle, mounted on a PC controllable 3DOF micromanipulator, is driven by a microdispenser. Two micro...
Metal films can be used as bonding layers at wafer-level in MEMS manufacturing processes for device assembly as well as just for electrical integration of different components. One has to distinguish between two categories of processes: metal thermo-compression bonding on one side, and bonding with formation of an eutectic alloy layer or an intermetallic compound. The different process principles...
In order to solve the pressure measurement problem in the harsh environment, such as high temperature above 200degC, a special piezoresistive pressure sensor chip has been developed. Based on the MEMS (micro electro-mechanical system) and SIMOX (separation by implantation of oxygen) technology, the piezoresistive pressure sensor chip was constituted by silicon substrate, a thin buried silicon dioxide...
We have newly proposed heterogeneous multi-chip module integration technologies in which MEMS and LSI chips are mounted on Si or flexible substrates using a self-assembly method. A large numbers of chips were precisely and simultaneously self-assembled and bonded onto the substrates with high alignment accuracy of approximately 400 nm. Thick MEMS and LSI chips with a thickness of more than 100 mum...
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