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IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 12 > 1776 - 1784
Electronics Letters > 2016 > 52 > 6 > 481 - 483
IEEE Transactions on Electron Devices > 2014 > 61 > 7 > 2302 - 2308
IEEE Transactions on Electron Devices > 2014 > 61 > 8 > 2944 - 2949
2010 Proceedings of ESSCIRC > 338 - 341
IEEE Electron Device Letters > 2010 > 31 > 9 > 996 - 998
IEEE Electron Device Letters > 2010 > 31 > 8 > 875 - 877
IEEE Electron Device Letters > 2010 > 31 > 5 > 473 - 475
IEEE Electron Device Letters > 2010 > 31 > 7 > 749 - 751
Ieee transactions on components and packaging technologies > 2009 > 32 > 4 > 808 - 815
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control > 2009 > 56 > 3 > 425 - 428
IEEE Electron Device Letters > 2009 > 30 > 5 > 460 - 462
IEEE Electron Device Letters > 2009 > 30 > 7 > 715 - 717
2008 IEEE 9th VLSI Packaging Workshop of Japan > 127 - 130
2008 10th Electronics Packaging Technology Conference > 1427 - 1430