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This paper proposes a technique that allows to decouple the polynomial chaos equations for statistical interconnect analysis. The methodology is based on a transformation that renders the voltage and current polynomial chaos coefficients decoupled. Hence, these new decoupled coefficients are computed via repeated non-intrusive simulations. The advocated method maintains comparable accuracy with respect...
This paper presents an improvement of the state-of-the-art polynomial chaos (PC) modeling of high-speed interconnects with parameter uncertainties via SPICE-like tools. While the previous model, due to its mathematical formulation, was limited to lossless lines, the introduction of modified classes of polynomials yields a formulation that allows to account for lossess and dispersion as well. Thanks...
This paper addresses the stochastic simulation of high-speed optical interconnects. It provides an effective solution for the inclusion of the effects of process variation or possible unknown device characteristics on the system response. The proposed approach is based on the stochastic collocation method and Lagrange interpolation. The results obtained on the transient analysis of a realistic on-board...
This paper addresses the stochastic simulation of transmission lines excited by random plane wave fields. A novel methodology is presented that is based on the polynomial expansion of the forcing terms accounting for field coupling in classical transmission-line equations. Thanks to the orthogonality of polynomials, the problem is recast as a superposition of a finite number of deterministic contributions...
This paper presents a stochastic SPICE model for through-silicon vias (TSVs). The model is based on recent state-of-the-art equivalent-circuit models for TSVs and allows to inherently include possible random variations of physical parameters. The underlying idea is the description of the stochastic circuit equations in terms of orthogonal polynomials, whose unknown coefficients are obtained from the...
This paper presents an effective solution for the analysis of long PCB interconnects with the inclusion of uncertainties resulting from different sources of variation, like temperature or fabrication process, on both the structure and loading conditions. The proposed approach is based on the expansion of the well-known frequency-domain telegraph equations in terms of orthogonal polynomials. The method...
This paper presents an effective solution for the transient analysis of long bus-like interconnects with the inclusion of geometrical and material uncertainties of the structure. The proposed approach is based on the expansion of the well-known frequency-domain telegraph equations in terms of orthogonal polynomials and on the back conversion to time domain via Fourier superposition. The method is...
This paper focuses on the derivation of an enhanced transmission-line model allowing to describe a realistic microwave interconnect with the inclusion of external uncertainties, like tolerances or process variations. The proposed method, that is based on the expansion of the well-known telegraph equations in terms of orthogonal polynomials, turns out to be accurate and more efficient than alternative...
This paper focuses on the derivation of an enhanced transmission-line model allowing to describe a realistic high-speed interconnect with the inclusion of external uncertainties, like tolerances or process variations. The proposed method, that is based on the expansion of the well-known telegraph equations in terms of Hermite polynomials, turns out to be accurate and more efficient than alternative...
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