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As GaN power devices emerge from research to industry, the characterization of these novel devices itself and its application in power electronic converters is essential. The purpose of this paper is to prove the capabilities of GaN technology using a novel 600 V normally-off GaN-on-Si transistor which shows no dynamic behavior of its on-resistance. A hard switching DC/DC converter prototype reveals...
We investigate the properties of ballistic spin field-effect transistors (SpinFETs). First we show that the amplitude of the tunneling magnetoresistance oscillations decreases dramatically with increasing temperature in SpinFETs with the semiconductor channel made of InAs. We also demonstrate that the [100] orientation of the silicon fin is preferred for practical realizations of silicon SpinFETs...
Big hopes are still placed in high mobility materials such as III-V compound semiconductors. The key new elements that may moderate this belief are: degradation of DIBL, subthreshold slope and gate capacitance due to larger dielectric constant and smaller density of states in III-V materials. We will show how DIBL plays directly on performance, especially in LP technologies. This effect is now for...
For the past three decades, power management efficiency and cost have shown steady improvement as innovations in power MOSFET structures, technology, and circuit topologies have paced the growing need for electrical power in our daily lives. In the last few years, however, the rate of improvement has slowed as the silicon power MOSFET has asymptotically approached its theoretical bounds. We will address...
We have developed a ballistic self-consistent code which couples the six-band k.p Hamiltonian to the Green function formalism. We investigate the influence of channel material (Si, Ge, SiGe and GaAs), crystallographic orientation ([100] and [110]) and strain (biaxial and uniaxial) on the ultimate double-gate pMOSFET performances. The results show that the best configuration is obtained with strained...
We present a GaN monolithic inverter IC on Si substrate and successful motor-drive by it for the first time. Taking advantages of the bi-directional operation free from the forward voltage off-set, the inverter can be operated just by the integrated six GaN-based normally-off gate injection transistors (GITs) without any external fast recovery diodes (FRDs) to flow the fly-wheel current. The IC enables...
This paper describes integration of an advanced composite high-K gate stack (4nm TaSiOx-2nm InP) in the In0.7Ga0.3As quantum-well field effect transistor (QWFET) on silicon substrate. The composite high-K gate stack enables both (i) thin electrical oxide thickness (tOXE) and low gate leakage (JG) and (ii) effective carrier confinement and high effective carrier velocity (Veff) in the QW channel. The...
To meet low power circuit requirements, increased channel mobility is required to boost transistor performance and reduce Vdd for lower power dissipation without performance penalty. SOI and more advanced engineered substrates developed on the SOI platform provide solutions for 32 technology nodes and beyond. The options include process-induced strain, biaxial strain virtual substrates, modification...
Gallium nitride is one of the materials of choice for high power, high frequency and high temperature applications. However, one key component of GaN transistors and diodes is the Schottky contact and it can create a weakness in the device when high leakage currents occur at small isolated regions containing dislocations. It has been reported that the electron affinity increases at certain defects...
An n-channel In0.65Ga0.35As LDMOS with Al2O3 as gate dielectric is proposed. Power device parameters such as specific on-resistance, gate charge, and breakdown voltage are examined using two-dimensional device simulation. Comparison between In0.65Ga0.35As Si devices is made. The InGaAs LDMOS shows a 92% improvement in Ron ?? Qg over its silicon counterpart.
The seamless integration of AlGaN/GaN transistors and Si CMOS electronics on the same chip will revolutionize digital and mixed signal electronics. In this talk we describe our group's effort on demonstrating this integration. Si-GaN-Si virtual substrates have been recently fabricated through substrate removal and wafer bonding processes. The very high thermal stability of nitrides allows for the...
We report the first demonstration of a surface channel inversion-type In0.53Ga0.47As n-MOSFET featuring gold-free palladium-germanium (PdGe) ohmic contacts and self-aligned S/D formed by silicon and phosphorus co-implantation. A gate stack comprising TaN/HfAlO/In0.53Ga0.47As is also featured. Excellent transistor output characteristics with high drain current on/off ratio of 104, high peak electron...
Two hybrid broadband distributed amplifiers were designed and fabricated in microstrip using deep-submicron AlGaN/GaN HEMTs grown on silicon. One design is optimized for high gain and achieves a measured S21 of 10 dB in the band of 0-17 GHz. The second is optimized for bandwidth and yields a measured S21 of 8 dB in the band of 0-22 GHz. To the best of our knowledge, such performances are unprecedented...
Prospects of velocity enhancement as the main driver of performance scaling in future CMOS are examined. Limits of velocity enhancement in uniaxially strained Si are first presented and then outlooks of novel channel materials such as Ge and III-V semiconductors are discussed. Finally, characteristics of performance scaling under power dissipation constraints are studied.
Using measurement techniques and appropriate models for III-V semiconductor compound transistors we have implemented a large signal model for a commercial LDMOS transistor. Based on this model a 4 Watt UHF class AB power amplifier was simulated and evaluated. The power amplifier was characterized using an aluminum test bench and microstrips. Experimental results shown an output power of 36.3 dBm for...
The prospect for the introduction of III-V semiconductors into the channel of n-type MOSFETs and thus replace Si with a high mobility material for 22 nm technology generation and beyond is examined in detail. The so-called implantfree (IF) III-V MOSFET architecture option is presented showing a fabricated n-type IF demonstrator suitable for scaling. We then focus on a prediction of the potential performance...
This paper describes about III-V integration on silicon and summarizes the recent progress on the research efforts to combine the merits of III-V and silicon, on the same silicon wafer, for future high-speed and low-power nanoelectronics. The successful integration of III-V on silicon can open up opportunities for integrating new functionalities and features on silicon, such as integrating logic,...
This paper presents simulations on tunnel field-effect transistors (TFET) and comparisons carefully to assess their impact at the same supply voltage. Current-voltage characteristics are simulated for n and p TFETs with different channel materials:Si,Ge,InGaAs, and InAs. Results show that InAs has the highest current for its smallest bandgap and effective mass, but it can not meet the off-state leakage...
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