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In system level electromigration test of 2.5D IC, Joule heating enhanced electromigration failure has been found to occur in redistribution layer in the interposer. In our test samples, there are two redistribution layers (RDL), each between every two levels of solder joints, so there are three levels of solder joints. First, the microbumps connect a Si chip on top and an interposer chip in the middle...
The demand for high performance systems is rising. Whether to look at the high resolution and color depth requirements of upcoming display generations, high bandwidth network communication, or at high performance computing in general, to need to transfer data as fast as possible inside a system is crucial. A crucial aspect is the memory/processor interface, which faces multiple challenges such as...
Amongst the cooling solutions proposed to mitigate heat hazard effects in microelectronics, heat spreaders seem to be one of the most suitable when thickness and space constraints are considered. This work proposes the use of graphite-based materials as heat spreaders for thermal management of flipchip configurations. Experimental tests and numerical simulations show a significant improvement in the...
Heat generation in integrated circuits has become in few decades one of the most limiting factors for performance improvement in mobile device components, such as cell phones or tablets. In these devices, heat dissipation is limited to a few Watts as state of art cooling systems, such as heat-sinks or fans, do not fit with the dimensional and power consumption constraints. Amongst the solutions proposed...
In this paper a two-dimensional transient thermal model of the rotor of an induction motor during reactor starting is presented using finite element formulation and arch-shaped elements. Excepting for providing a more accurate representation of the problem, the proposed model can also reduce computing costs. A temperature-time method is employed to evaluate the distribution of loss in various parts...
Three dimensional integrated circuits (3D ICs) have attracted much interest in the recent past, because of their capabilities for more efficient device integration and faster circuit operation. 3D integration relies on through silicon via (TSV) interconnection and interlayer bonding between the silicon layers. Because 3D IC is vertically stacked, higher temperature as well as temperature concentration...
In this paper, changes of thermal conductivity of paraffin mixtures joined different percentages of aluminum, copper, silicon powder were stuPdied. Feasibility of adding these three kinds of powders into paraffin to enhance paraffin's thermal properties was studied, as well as the influence of different addictives on paraffin's phase-change temperature and latent heat. The results showed that adding...
Recently, the dimensions of the flip-chip solder bumps reduce to about 20-30 micrometers, also known as "micro-bumps" sandwitched between two Si chips. In such a structure, electromigration and thermomigration behaviors in the micro-bumps are not clear now. In this study, the temperature map distribution of Al traces and Al pads in CoC and C4 structures during current stressing was directly...
Thermal modeling of a 3-D IC stack consists of three IC layers bonded back-to-face (or face up) is performed. Significant temperature rise in the top layers is projected with the presence of dielectric isolation films between the IC layers. It is found that by inserting electrically isolated thermal through silicon via (TTSV) having Cu core and oxide liner that extends across the layers to the silicon...
A new bonding process has been developed for producing direct bonded aluminum (DBA) substrates using aluminum nitride (AlN). A transient eutectic liquid phase forms in aluminum-X (X = silicon, germanium, silver, or copper) systems at the interface between the aluminum foil and the AlN substrate. The aluminum-X liquid phase transiently contacts the AlN substrate prior to isothermal solidification by...
Thermal simulation of a stack consists of three IC layers bonded ??face up?? is performed using finite element modeling. Significant reduction of ~62??C in maximum chip temperature is predicted by inserting an electrically isolated thermal through silicon via (TTSV) having Cu core and oxide liner shell that extends across IC layers to the substrate. The effects of TTSV dimensions and its extension...
From the available mass production devices of HFCBGAs, there can be a range of surface roughness with different surface finished of silicon dies and heat spreader. An aluminum filled gel is used to examine the surfaces clamping with both identical substrates at both sides whether compatible to the thermal conduction. Their thermal contact resistances are measured by laser flash technology and therefore...
The micro-channel heat sink (MCHS) is almost using a separate production of silicon or copper MCHS, which is indirectly on package dimensions. Using this package structure of the heat sink, the temperature of its central region is much higher than the surrounding region. It makes the surface of the hot load non-uniformly. At present, most of the studies have adopted the uniform thermal load, regardless...
Computations of operating temperatures in microfabricated upper-millimeter-wave sheet beam traveling wave structures are provided. The studies include the effects of different cooling techniques and construction materials. The scaling of output power capability vs. frequency, as constrained by thermal limits, is also presented.
The technique of laser-assisted nanoimprinting lithography (LAN) has been proposed to utilize an excimer laser to irradiate through a quartz mold and melts a thin polymer film on the substrate for micro- to nano-scaled fabrications. In the present study, the novel concept of that copper was adopted as the substrate instead of silicon, which is conventionally used, was proposed. The micro/nano structures...
ldquoDevelopment for advanced thermoelectric conversion systemsrdquo supported by the new energy and industrial technology development organization (NEDO) has been successfully completed as one of the Japanese national energy conservation projects. Three types of the cascaded thermoelectric modules operating up to 850 K in high electrode temperature and two types of Bi-Te thermoelectric modules operating...
Bulk nanostructured (Bi,Sb)2Te3 compounds and GeTe based amorphous/nanocrystal composites have been successfully fabricated by the combined hydrothermal/hot-pressing and quenching/annealing methods, respectively. The (Bi,Sb)2Te3 nanopowders synthesized by hydrothermal method exhibit a hollow-like structure. After hot-pressing, the nanoscale grains varying from tens to hundreds of nanometers were found...
Cooling is important to keep the temperatures of the highly integrated silicon electronic devices and power devices e.g. power MOSFET, IGBT. Yamaguchi et al. have proposed a new scheme to cool down the devices by its own current named ldquoself-cooling devicerdquo, in which the cooling process uses Peltier effect. In the proposed scheme, we should use the materials that have high thermal conductivity,...
In this study, we fabricated in-plane thermoelectric micro-generators (4 mm times 4 mm) based on bismuth telluride thin films by using flash evaporation method. The thermoelectric properties of as-grown thin films are lower than those of bulk materials. Therefore the as-grown thin films were annealed in hydrogen at atmospheric pressure for 1 hour in a temperature range of 200 degC. to 400degC. By...
Nanostructuring is one of the effective approaches to lower the thermal conductivity of materials. Nanostructured skutterudite-related compounds CoSb3, Fe0.5Ni0.5Sb3, Fe0.25Ni0.25Co0.5Sb3 and Te-doped CoSb3 were synthesized by a solvothermal route. The bulk materials were prepared by hot pressing or spark plasma sintering from the solvothermally synthesized nanopowders. The thermal conductivity values...
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