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In this paper, we study the finite time consensus problem for multi-agent systems with double-integrator dynamics under an undirected graph. Both the leaderless consensus problem and the coordinated tracking problem with a dynamic leader are considered without velocity measurements. Based on an observer for each agent, we present two distributed control protocols for the two cases which can solve...
From the viewpoints of mobile subscribers, the valuation of transmissions on different periods are different. Therefore, when we apply a pricing mechanism for congestion control, the number of transmission events on periods will be redistributed according to the type of application, the valuation, and the price in each period. Considering the traffic redistribution effect, in this paper we propose...
In this paper, patterned Cu and Si substrates are interconnected via solder alloys through Al/Ni self-propagating nano-film to obtain hermetical packaging for infrared detector. During the joining process, substrates which are coated with different solder layers (e.g. Sn and AuSn) are bonded under various atmospheres. By optimizing joining parameters, reliable metallurgical joints between Si/Cu and...
In this work we demonstrate a new selective metallization technique to perform localized plating on the screen-printed Al contact using the innovative approach based on Dynamic Liquid Drop/Meniscus that is able to touch the cell back contact in specific defined positions and show that it is possible to produce suitable electrical and mechanical contact with Al-Si and thus to replace the silver from...
This paper aims to study the correlation between intuitionistic fuzzy sets obtained as image of intuitionistic fuzzy t-norms and t-conorms. We consider the action of automorphisms and the class of strong fuzzy negations in order to verify the conditions under which the correlation coefficient related to such fuzzy connectives and their corresponding conjugate and dual constructions are obtained. We...
Recently, three dimensional integration circuits technology has received much attention because of the demands of gradually increasing functionality and performance in microelectronic packaging for different types of electronic devices. For 3D chip stacking, high density interconnections are required in high-performance electronic products. Though the bumping process used could be either electroplating...
In high power electronic modules for automobiles, several alumina circuit boards are soldered to a copper (Cu) plate. In this project, we look into iron as an alternative basis plate material. The use of iron (Fe) dates back to prehistoric times. Iron was made into various steels by adding other elements. The most popular steel is carbon steel. Steel of low carbon content of 0.1–0.2% is a trade-off...
To achieve high density and high speed transmission between chips, a silicon interposer with copper (Cu) Through Silicon Vias (TSVs) technologies have been required. In previous papers, we reported process development and integration with 200mm wafer. It has been shown that high aspect ratio TSVs were filled with Cu without any voids. Delamination of dielectric layers did not occur on both side of...
For the first time, nano-meter-scaled 1T-1R non-volatile memory (NVM) architecture comprising of RRAM cells built on vertical GAA nano-pillar transistors, either junction-less or junction-based, is systematically investigated. Transistors are fabricated using fully CMOS compatible technology and RRAM cells are stacked onto the tip of the nano-pillars (with a diameter down to ∼37nm) to achieve a compact...
Wide bandgap materials have become very attractive for power electronics due to their physical properties that allow junction temperatures up to a theoretical limit of 600°C. In contrast, the maximum operation temperature of conventional silicon semiconductors is limited to approximately 200°C. The high-temperature operation of wide bandgap switches allows an increasing power density of power converters...
In order to insure the reliability and the validity of the detection capability and detection data, 10 oil emission spectrometry laboratories which distribute in different areas tested 3 lubricating oil samples composed by different elements content, and interlaboratory comparisons for the detection capability of oil emission spectrometers were carried out. Based on robust statistical techniques,...
Since 3D-IC becomes popular nowadays, solder micro-bumps plays an important role to develop TSV technology. This study verifies solder micro-bump efficiency via cracking as index. The micro-bump cracking is observed at the interface of intermetallic compound (IMC) layer after Si chip and Si carrier bonding. It was found that P-rich Ni layer will perform weaker and brittle solder joint by means of...
Silicon die stacking with low-volume interconnections is an attractive method for 3D integration. It offers such benefits as extension to fine-pitch integration, increased vertical heat transfer and hierarchy for repeated thermal processes without re-melting. The process uses low-volume solder to form joints of few microns high. The low-volume solder mostly forms intermetallic compounds with underlying...
We performed stacking experiments on Si dies using annular tungsten TSVs (Through Silicon Vias) and Cu studs with low-volume solder micro-bumps. Unlike standard 100-micron C4 (Controlled Collapse Chip Connection) solder balls, very small solder volumes (< 6 microns in height) form IMC (InterMetallic Compounds) in the junctions during the bonding or reflow processes. The two interconnect metallurgies...
During Ti/TiN barrier metallization of a shared contact in SRAM, an NH3 soak treatment selectively deoxidized silicon oxide on NiSi at the gate shoulder, improving the resistance of the contact. This deoxidizing NH3 soak treatment drastically reduced the drawbacks of conventional NH3 plasma treatment: plasma-induced damage of gate oxide and excessive nitridation of Ti/TiN. Although NH3 gas does not...
Target recognition algorithm based on support vector machine of optimum parameters is put forward in this paper. Firstly, local surrounding-line integral bispectrum feature is extracted from the bispectrum of range profile of target. Secondly, parameter scope is obtained through experiment method, optimum parameters of support vector machine are gotten using genetic algorithm. Finally, support vector...
The ultra-thin nickel silicide films were grown using both soak and spike anneals from temperatures from 160??C to 400??C in 10-20??C intervals as a means to characterize the low temperature annealing capabilities of our RTP system. The Rs transformation curves were generated and the resulting films were characterized by Rs and xTEM. A ~5 nm Ni2Si film is formed at 160C from a starting material of...
This paper focuses on evaluating the adhesive strength of silver-tin (Ag-Sn) solder-jointed single-crystal silicon (SCS) specimens. The exothermic reaction in aluminum-nickel (Al/Ni) multilayer film was used as a heat source for melting the solder film. The reaction generated heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point...
The Cramer-Rao bound (CRB) with its modifications is a well known lower bound on the variance of any unbiased estimator of an unknown parameter. Focusing on the estimation of the time-delay experienced by a digitally modulated signal, we first introduce an approximation of the modified Cramer-Rao bound (MCRB) as a function of the spectral properties of the modulated signal, irrespective of the specific...
Developments of ultra fine pitch and high density solder microbumps for advanced 3D stacking technologies are discussed in this paper. CuSn solder microbumps with 25 ??m in pitch are fabricated at wafer level by electroplating method and the total thicknesses of the platted Cu and Sn are 10 ??m. After plating, the micro bumps on the Si chip are reflowed at 265??C and the variation of bump height measured...
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