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In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
In this study, the drop test simulation for a typical stacked memory device with 8 units integrated vertically on board-level was performed by finite element method. The units were connected with each other through copper lead frames and assembled on the PCB by pins. The computational model of the device was built in ANSYS and the drop test of this board-level assembled device was investigated by...
The dropping test of WLCSP with RDL on board-level was investigated by numerical method in this study. The asymmetric pattern of WLCSP devices mounted on the PCB board was considered. Using the finite element analysis, the stress and energy in the WLCSP with RDL was predicted under the dropping test conditions. The critical locations of WLCSP device on the PCB in the dropping test were identified...
Many lead-free solder alloys have been proposed as alternatives to the conventional eutectic Sn-37wt%Pb (SnPb). This replacement induces the drop/impact reliability issues of portable products. Under the drop/impact loading, the main failure mode is interfacial brittle failure between lead-free solder joints and intermetallic compound (IMC) layer. The identification of failure mechanism in the solder...
Board level drop test and thermal cycle are the keys qualification tests to ensure the solder joint reliability. It becomes critical due to leadfree solder. The work reported here explores the effect of underfill on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WLCSP's. An unfilled underfill was found to provide superior drop test performance. Silica filled...
A dynamic substructural method (DSM) is developed to simulate the board level drop test of a wafer level chip scale package (WL-CSP). Parametric study on package location at the test board, printed circuit board (PCB) thickness and WL-CSP package thickness is conducted in the board level drop test simulations. The peeling stress and first principle stress of the solder joints are checked and discussed...
The recent requirements for achieving higher memory density in a smaller package size have adopted 3D packaging of thin dies in a single package. However, increasing the number of dies in 3D stacking is limited by increasing the cost due to decrease die stacking yield. The known good package stacking can be solution to overcome such yield loss. In this study, a novel Fan-in PoP solution proposed,...
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