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For some applications like ship, aircraft and car, electronic systems are submitted to salt environment. In this case, the main reliability issue is the corrosion of the metals from the pads and the solder alloys. More than 20% of failures in microelectronic devices can be attributed to corrosion. Nevertheless this phenomenon is little studied on microelectronic assemblies. This paper presents ageing...
There are a number of final finishing technologies available in the market, each with different cost and performance attributes. The unique attributes of the Selective ENIG process have made it a popular choice for mobile device and high density interconnect (HDI) applications. This hybrid final finishing process combines the benefits of both ENIG and organic solderability preservative (OSP) processes...
Solder paste plays a critical role in SMT (surface mount technology) and reflow soldering. And flux is an important material in composition of solder paste. Due to the drive towards lead-free electronic packaging and no-clean soldering technology, a new no-clean flux contained composite activators was formulated specifically for lead-free paste. Spread test was carried out to evaluate the activity...
Electroless nickel and immersion gold (ENIG) is one of the most common final finishes used in PCBs. ENIG surfaces exhibit excellent planarity, solderability and wire bondability and tolerate multiple lead free solder reflows during assembly processing. However, the price of gold has increased rapidly from around $400 US per troy ounce in 2004 to over $1200 US in 2010. This change has increased ENIG...
This paper presents an investigation on field returned open and short failures related to printed circuit board (PCB), including via hole crack, prepreg crack and insufficient circuit etching. After an experimental study with cross section, time domain reflectometry (TDR), and finite element (FE) modelling, it was found that weak plating and corrosion induced via hole crack was a major root cause...
In the study, the Ni underlayer plus matt Sn plated packages in PLCC, PDIP and LQFP were subject to SnAgCu and SnPb surface mounting and wave soldering respectively on the PCB with OSP surface finish, then followed by TCT (-55degC to 85degC) 1000 cycle, THT (60degC/90%RH) 3000 hrs to investigate whisker growth propensity. The practical whisker performance confirmation on the PCB beyond reflow simulation...
The solderability of SnAgCu (SAC305) and SnCuNi (SCN) alloys for DIP components on thick PCB (2.3 mm) with OSP and LF-HASL surface finishes were studied. Force rework was also applied after DIP process by using SCN and SAC305 solder alloys. In addition, the SCN solder properties, including copper dissolution, mixed alloys, solder joint corrosion, and corrosion property to soldering tank were tested.
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