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A novel high temperature silicide process using millisecond anneal is reported. Superior thermal stability, film properties (Rs, surface roughness) and low contact resistivity to n+ silicon of <; 1 Ωμm2 is demonstrated with milli-second silicide anneal which results in grain size change and potential strain incorporation resulting in overall enhanced performance.
Spacer-less In0.7Ga0.3As n-MOSFETs with self-aligned Ni-InGaAs contacts formed using a direct reaction between Ni and InGaAs were demonstrated. A novel salicide-like metallization process was developed to achieve self-aligned Ni-InGaAs contacts, comprising the steps of Ni reaction with InxGa1-xAs and selective removal of excess Ni. Dopantless n-MOSFETs with metallic Ni-InGaAs source/drain (S/D) and...
In this paper, we examine the physical properties of NiSi/p-Si implanted with various combinations of aluminum (Al) and sulfur (S) doses for Schottky barrier tuning. Techniques used included HRTEM, TOF-SIMS, HAADF STEM, and EDX. We also measured the integral interfacial dose (IID) of Al and S, i.e. amount of Al and S found with 2.5 nm of the interface, and correlated it to the Schottky barrier height...
This paper is meant to be a general overview of recent advances in new processes and process tooling (implant and anneal) for advanced junction formation. Also included are details of impact of novel implant processes, such as cold implant and pre-amorphization (PAI) implants on Nickel Silicide (NiSi) formation. We will also discuss subtle impacts of wafer temperature during ion implantation on channel...
A novel approach exploiting the concept of NiSi:C/Si:C interface dipole engineering for electron barrier height ??BN reduction is demonstrated in strained n-FinFETs using S+ ion implant. The new approach is simple and promising for reducing contact resistance RCSD in advanced device architectures such as the FinFETs.
Crystalline silicon photovoltaic (PV) industry is growing at an average rate of ~ 15%. Continuing carbon-based fuel depletion in combination with increasing green house effects will continue to add to this robust growth trend. Conservative estimates indicate that PV market will reach ~ 100 GWp/year before the year 2020. In order to sustain such production levels, impact on materials and supplies supporting...
This paper demonstrates the integration of Al segregated NiSi/p+-Si S/D contact junction in p-FinFETs for parasitic series resistance reduction. Al is introduced by ion implant into p+ S/D region followed by nickel deposition and silicidation. Drive current enhancement of ~15 % is achieved without any degradation of short channel effects. This is attributed to the lowering of PhiBp of NiSi on p-Si...
We have developed a novel dual phase-modulated Ni silicide for Schottky barrier and series resistance reduction in dopant-segregated source/drain (DSS) n-MOSFETs. Using pre-silicide N2+ implant (thereafter N-implant), it is possible to selectively form interfacial epitaxial Si-rich NiSi2, reducing electron Schottky barrier(SB) from 0.7 eV to 0.34 eV while maintaining a low resistive bulk NiSi, at...
We report, for the first time, a simple and cost effective co-integration of strained p and n-FETs using tin (Sn) and mono-carbon (C) implant in Source/Drain (S/D) of p- and n-FETs, respectively, to induce beneficial strain. For the first time, a single laser anneal step was employed to substitutionally incorporate the Sn and C atoms simultaneously into lattice sites. 7 at.% substitutional Sn concentration...
We report a novel contact technology comprising Selenium (Se) co-implantation and segregation to reduce Schottky barrier height PhiBn and contact resistance for n-FETs. Introducing Se at the silicide-semiconductor interface pins the Fermi level near the conduction band, and achieves a record low PhiBn of 0.1 eV on Si:C S/D stressors. Comparable sheet resistance and junction leakage are observed with...
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