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The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is a very important technology for next generation communication devices and internet of things (IoT) applications. Recently, integrated fan out wafer-level...
Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
System-in-Package (SiP) is becoming more and more important in integrating functionality while reducing final product form factors and cost. This is particularly true for mobile applications where continued effort to achieve ever thinning products is continuously pushing development of new materials, components and assembly technologies. This presentation focuses on a SiP flip chip (FC) pad design...
X-Ray Diffraction (XRD) is a very efficient experimental tool for strain/stress analysis at different scales, which makes possible to carry out some mappings in complex 3D flip chip assemblies. First, with single crystal method, both the chip and the substrate have been analyzed at the same positions, considering a 1mm2 step, in order to quantify the level of stress inside. Then Kossel microdiffraction...
Fine pitch copper (Cu) pillar bump adoption has been growing in high performance and low-cost flip chip packages. Higher input/output (I/O) density and very fine pitch requirements are driving very small feature sizes such as small bump on a narrow pad or bond-on-lead (BOL) interconnection, while higher performance requirements are driving increased current densities. Assembling such packages using...
The quest for thin, low profile packaging solutions for mobile devices and cost reduction with improved performance continues to drive the development of new packages. The development of fan-out wafer level package (FO-WLP) is the latest industry trend. There are increasing number of suppliers for FO-WLP and a growing number of applications. This paper examines the market trends and drivers for package...
As the demands of higher performance, higher bandwidth, and lower power consumption as well as multiple functions increases, the industry is driving advance technology developments in emerging markets, especially in portable and mobile devices to meet these requirements. The utilization of emerging technologies is pushing smaller form factor package designs with finer line width and spacing as well...
In this work, the 14 nm CPI (Chip and Package Interaction) challenges, development and qualification were investigated by using 80 um pitch Cu pillar BOL (Bump on Lead) technology in flip chip CSP package. We evaluated 14 nm BEOL (Backend of Line) film strength and adhesion in the torture tests as an early assessment. After passing the torture tests, the package is evaluated in the CPI reliability...
For performance improvement of electromagnetic actuators an increasing amount of sensors providing real-time feedback of measureable system variables is needed. In industrial components usually several signals have to be detected or even controlled. Therefore numerous data are to be analyzed in a wide range of characteristics. To meet specific system requirements, e. g. weight and size, the sensors...
Increased end user reliability expectations coupled with the deployment of complex electronic systems in product applications such as automotive, military and avionics is driving a continual growth in the duration of validation testing.
In this study, a 3D copper pillar bumps model was established to investigate the reliability of the interconnection under thermal-electric coupling. In order to ensure the accuracy of the model, infrared thermography was used to verify the simulation of temperature distribution. The test not only proved the feasibility of this model, but it also indicated impact of Joule heat effect on temperature...
This paper reports on the development of packaging technology for the assembly of 30µm pitch micro Cu pillar bump (15µm diameter) on organic FCCSP substrate having bare Cu bondpad without NiAu or OSP surface protection. The assembly was performed by thermal compression bonding (TCB) with non-conductive paste (NCP). Finite element modeling and simulation were carried out to understand the Cu pillar...
Gallium liquid metal joints are described as an alternative to higher melting point tin-or lead-based solder joints in flip chip packages. A complete assembly process is described, including the bumping process with the electrodeposition of gallium on corrosion resistant bonding pad, a low-temperature and low bonding force chip joining process with a HCl flux, and an underfill process with a low stiffness...
As Cu bump is widely adopted in microelectronic IC product packages for broader scope of applications throughout network communication and handheld device, it impacts on the interconnection joint integrity of package substrate to IC pad need to be well understood and managed which becomes even more critical as extreme Low-k (ELK) inter-metal dielectric material (IMD), with lower mechanical strength,...
System integration with high data transmission often demands packaging solution having fine line routing capability in order to deliver the desired performances with better power and signal integrity. However, while wafer fabrication is advancing at a relentless pace, IC substrate technology has not been able to catch up device's fine feature needs at reasonable cost. This is due mainly to resin materials'...
Current-induced failures in fine pitch Sn micro-bump with Cu pillar have been investigated under a high current density of 3∗105 A/cm2 and temperature of 150°C. Both joule heating and high current density led to void formation and an abrupt increase of electrical resistance at the onset of the current stressing. The electrical resistance fluctuated for a period of time when Cu and solder continue...
Moisture voiding in underfill materials can cause reliability issues for the flip chip packages. The bake-out step included in the assembly process flow to avoid this problem cannot be completely efficient for some large die size packages. This is due to complex substrate circuit designs and time delays subsequent to the bake-out step. This paper proposes using the variable frequency microwave cure...
Smart phone & portable devices have dominated the Semiconductor growth, and drive the IC packages to smaller, lighter & thinner, but integrate more function. Besides SOC solution being driven by design house or system company, we have seen more packages of Quad Flat Non-lead (QFN), wafer level CSP (WLCSP), fan out WLCSP (FOWLP) and system in package (SIP) are being widely used in smart phone...
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can...
The trends towards miniaturization in the electronics industry coupled with advances in flip chip technology have increased the use of flip chip on board or direct chip attach technology in many products. This is especially true for products where re-work is not an option. Reliability issues were overcome by the use of underfill to couple the chip to the substrate and subsequently significant advances...
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