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The semiconductor packaging technology trend for electronic products continues to achieve greater miniaturization and higher functionality. Thinner profile chip scale packaging (CSP), such as flip chip CSP (fcCSP), with increasing die complexities is a very important technology for next generation communication devices and internet of things (IoT) applications. Recently, integrated fan out wafer-level...
Conventional flip chip technologies such as the mass reflow (MR) process and the thermal compression bonding (TCB) process are commonly used technologies in the micro assembly field. However, there is a continuous need for next generation interconnection technology to achieve a low form factor with increasing die and substrate complexities. Moreover, very thin 3D integrated packages and 2.5D packages...
Recently, technologies related to Fine Pitch Flip Chip or FPFC have been great achievements for various next generation devices, allowing a significant increase in the number of signal I/O and achieving low form factor packages. Consequently, fine pitch Cu pillar flip chip Chip Scale Package (CSP) with small sized die, with package dimension of less than 16×16mm, is already under high volume production...
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