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The mechanical properties and microscopic mechanism of the solder joint at cryogenic temperature were studied. The effects of temperature and Pb content on the reliability of the solder joint were investigated. The temperature has a significant influence on the shear strength of the solder joint. As the temperature decreases, the shear strength increases continuously, and the shear strength of solder...
In this study, a 3D copper pillar bumps model was established to investigate the reliability of the interconnection under thermal-electric coupling. In order to ensure the accuracy of the model, infrared thermography was used to verify the simulation of temperature distribution. The test not only proved the feasibility of this model, but it also indicated impact of Joule heat effect on temperature...
The effect of Pb content on fatigue life of mixed SnAgCu-SnPb solder joints was investigated by thermal cycling with temperature ranging from −55°C to 125°C (with 10 min dwell times and 10°C/min ramp rate). The cross-sections of mixed solder joints were characterized by scanning electron microscopy equipped with energy dispersive spectrometry. The results showed that the thermal fatigue life of Sn3...
This work aims to characterize the microstructure and temperature field of the hermetic packaging structure by welding the cover made of Kovar alloy and the base made of a low-carbon low-alloy steel (i.e., #10 steel) using parallel seam welding (PSW) process. The microstructure of welded joints and distribution of elements were analyzed by scanning electron microscopy (SEM) equipped with energy dispersive...
The effect of Pb content in the rang of 0∼37wt.% on solidification behavior and shear performance of Sn3.0Ag0.5Cu/Cu joint was investigated. It was shown that Pb contamination showed a significant influence on the solidification behavior of Sn3.0Ag0.5Cu/Cu joint. A little amount of Pb resulted in the formation of ternary eutectic Sn-Pb-Ag phase with a low melting temperature and a mushy region between...
The effects of PCB parameters and boundary constraint condition on stress distribution of glass insulator in DC/DC power module are investigated by using finite element analysis. Results show that the constraint condition and thickness of printed circuit board (PCB) have significant effect on the stress of glass insulator compared with the size of PCB. The value of maximum equivalent stress in glass...
The key factors on measurement accuracy of infrared thermometer are investigated by experimental analysis. In this study, the temperature of a certain DC/DC power module is measured under various kinds of condition by using infrared thermometer(FEI, MWIR-512). It is found that the electric parameters, magnification of objective lens and measurement environment condition have significant effect on...
High density assembly results in evident thermal coupling effect among chips in MCM. Junction temperature is decided by self-heating effect and thermal coupling effect. It can be accurately calculated by using the thermal resistance matrix. This paper focused on thermal coupling effect and presented heat conduction routes and thermal resistance model of three different MCM (lateral-chip, stacked-chip...
The influence mechanism of different pad types (SMD and NSMD) on the shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated by experiment and Finite Element Analysis (FEA) method. The shear force of NSMD solder joint was significantly higher than SMD solder joint by using ball shear test method according to JSED22-B117A standard. The difference in shear force was attributed to the different...
The relationship between reflow profile parameters (soak temperature and soak time, reflow temperature and reflow time, cooling rate) and shear performance of Sn3.0Ag0.5Cu/Cu solder joint was investigated. It was found that soak time, reflow temperature and cooling rate had significant influence on the shear performance of Sn3.0Ag0.5Cu/Cu. Adequately prolong soak time and increase reflow temperature...
This work aims to characterize the microstructure and temperature field of the hermetic packaging structure by welding the cover made of Kovar alloy and the base made of a low-carbon low-alloy steel (i.e., #10 steel) using parallel seam welding (PSW) process. The microstructure of welded joints and distribution of elements were analyzed by scanning electron microscopy (SEM) equipped with energy dispersive...
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