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Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-$\mu \text{m}$ lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than $15\times15$ ...
Increased end user reliability expectations coupled with the deployment of complex electronic systems in product applications such as automotive, military and avionics is driving a continual growth in the duration of validation testing.
Multi-terminal passive components like interdigitated capacitors (IDCs) are a key enabler for power supply decoupling and controlling transient chip responses at high frequency for improved performance and functionality. To ensure higher performance is achieved, the integrity of the solder joint connecting the passive component to the organic build-up substrate in a flip chip ball grid array (FCBGA)...
The cost and the package size driven size reduction of semiconductors lead to much higher heat generation. Also the use of new high power technologies on the basis of SiC produces is a need for high conductivity of the interconnect materials. Therefore the requirements for mechanical, thermal and electrical properties of interconnect materials increase compared to existing eutectic solder and glue...
Molded underfill (MUF) process for system in package with WLCSP package with cu pillar bump would be the future application in SIP module assembly due to small form factor and low cost of WLCSP and good electrical, thermal performance, fine pitch and lower cost of cu pillar bump. However, higher stiffness of cu pillar could cause interface fracture between cu pillar and solder bump during SMT process...
Within this paper, we present a guideline for the mechanical acceleration of reliability experiments for end-of-lifetime prognostics of metal based die attach materials. First, we used an advanced hybrid nano-effect sintered silver layer as interface between die and substrate which has very good electrical and thermal conductivities. Two pairs ofexperiment/simulation are scheduled. An isothermal mechanical...
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can...
This paper discussed the influence of temperature on SnPb solder joints reliability and chrysanthemum link design by using flip chip device, the UBM structure for Ti/Cu/Cu, substrate using alumina ceramic substrate. Testing every 100 cycles on the flip chip samples are electrically connected test, failure analysis of flip chip bonding specimen failure. The test results show that, the underfill can...
High reliability at the board level is challenging for a large flip chip ball-grid-array (fcBGA) where large die and stiff substrate are used. For those BGA solder joints, the difficulty is to achieve high reliability in both thermal cycling and mechanical dynamic tests. This paper presents experimental work on an fcBGA with a die size of 25×15mm, a body size of 40×40mm and over 1700 ball count. The...
Occurring from many years a impetuous growth of electronic devices manufacturing, induced by introducing a new functionalities for customers and moving towards replacing hazardous substances such as lead in electrical and electronic equipment caused that a reliability of solder joints is more important issue in electronic assembly. Reliability of solder joints plays a major role in the electronic...
We successfully fabricated an eco-friendly Cu-Zn wetting layer for Sn-Ag-Cu (SAC) solders by electroplating in a cyanide-free solution. The reliabilities of solder joints formed on the Cu-Zn solder wetting layer were evaluated through the drop impact test and thermal cycling (T/C) test. First, boardlevel drop impact test was performed with the SAC solder joints formed on electroplated Cu or Cu-Zn...
TSV (Through Silicon Via)-based interposer has been proposed as a multi-die package solution to meet the rapidly increasing demand in inter-component (e.g. CPU, GPU and DRAM) communication bandwidth in an electronic system. he stacked-silicon die package configuration may give rise to package reliability concerns not observed in conventional monolithic flip-chip packages. 3D finite element method...
The reliability of flip chip bumps remains a concern even after underfilling the gap between the chip and package substrate. A number of factors influence this reliability and it is desirable to evaluate the effect of these factors through simulations. However, underfilling introduces new material and modeling variables into the simulation methodology which need to be considered carefully. This paper...
While in the past, the silicon, package and system could be designed sequentially, at silicon nodes less than 40nm, the interconnects between the chip, package and system are becoming the limiting factor in performance and reliability. Hardware designers need to know upfront, what tradeoffs they need to make, to design an optimal system level solution. Quantitative estimates on the optimal package...
For high memory density DDR3 BOC packages with thin copper foil thickness, module level solder joint reliability during the thermal cycling test is a critical issue. In this paper, 3D FEA thermal fatigue life models are established and analyzed with detailed considerations of pad design, realistic geometry of solder joint and nonlinear material properties. The validated models have the capability...
Through-silicon-via (TSV) technology permits devices to be placed and wired in the third dimension. Currently, there is a strong motivation for the semiconductor industry to move to 3-D integration using the TSV approach due to many advantages of TSV application. However, there are also some challenges for stacked die package with TSVs. One of the challenges is thermo-mechanical reliability of multi-layer...
A global/local method along with an optimization algorithm, so called the modified sub-modeling approach of the optimal equivalent solder is introduced as a simple but effective approach to predict the deformation and the reliability in the package. The viewpoint of equivalent solder in this method is facilitated to obviously reduce the number of elements/nodes so as to enhance computing accuracy...
A global/local method along with an optimization algorithm, so called the modified sub-modeling approach of optimal equivalent solder is introduced as a simple but effective approach to predict the deformation and the reliability in the package. The viewpoint of equivalent solder in this method is facilitated to obviously reduce the number of elements/nodes so as to enhance computing accuracy and...
In this paper, we comprehensively investigate the fatigue life and the failure modes of horseshoe-patterned stretchable interconnects, through both experimental and numerical analysis. The experimental results demonstrate that the fatigue life of a horseshoe-patterned stretchable interconnect embedded into a silicone matrix is able to resist up to 3000 cycles for a uniaxial elongation of 10%. By increasing...
The fatigue life and reliability of 3D stacked die package becomes very important due to the coupling effect among all materials, especially in twin die stacked package. The article presents the quickly and more accurate optimal design for such case. Firstly, the Darveaux model is applied to predict the solder ball reliability of the stacked die package under a cyclic thermal loading condition. Then,...
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