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As the electronic packaging density continues to increase, flip chip or stacked packaging via bump bonding is gradually replacing traditional wire bonding and will become the mainstream packaging form in the future. For copper bumps, this new type of electronic interconnection has not yet been fixed by industry standards. Therefore, this paper has made a preliminary study on the reliability of this...
Ceramic nanomaterials are attractive due to the functional properties such as optical, electronic, thermal behaviors as well biocompatibility. In this work three kinds of functional ceramic nanocrystals, i.e. SiC (hexagonal platelet-like), TiC (truncated-octahedral) and TiN (cubic structured) were synthesized by a facial DC arc-discharge plasma process. Preparation atmospheres were chosen for the...
Generation of particle defects in semiconductor manufacturing is inevitable, but it has to be minimized for high IC yield. There are various causes for the generation of particle defects, depending upon semiconductor manufacturing processes. This work discusses various strategies, such as clean on go, idle paste, kit hardware selection that help to reduce the generation of defects in metal thin films...
Generation of particle defects in semiconductor manufacturing is inevitable, but it has to be minimized for high IC yield. There are various causes for the generation of particle defects, depending upon semiconductor manufacturing processes. This work discusses various strategies, such as clean on go, idle paste, kit hardware selection that help to reduce the generation of defects in metal thin films...
Alumina mixed tin oxide (SnO2: Al2O3) powders were obtained by employing chemical and physical synthesis methods. The powders were prepared from tin chloride as Sn source, urea (R1) and ammonia (R2) as precipitant agents. The resultant SnO2 powders are milled in a planetary ball mill. Finally, Al2O3 was added to the milled SnO2 powders manually in different ratios, and then pressed to manufacture...
Undoped and transition metal (Zn, Fe, Co) doped tin monoxide (SnO) nanocrystals have been synthesized by using the hydrothermal technique. The grown nanocrystals were characterized with respect to the determination of the formed phases, particle size, band gap and morphology, using the techniques of X-ray diffraction (XRD), UV-visible spectroscopy and Field Emission Scanning Electron Microscopy (FESEM)...
In this study, we firstly synthesized ternary Cu2SnSe3 nano ink by novel organic solvent polyetheramine by solvent-thermal reflux method. Cu2SnSe3 thin films were prepared by solvent-thermal reflux method for Cu/Sn ratio in three different ratios of 2/1, 1.8/1, and 1.4/1. Structure, surface morphology, composition, and electrical and optical properties at different process conditions were measured...
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
Ultrasonic bonding based on Ni micro-nano cones array (MCA) was developed in this study. Interfacial morphologies of bonding joints were investigated. The deformation of nanocones demonstrated the complexity of initial indentation process. Analysis of morphology evolution under different bonding pressure revealed that interfacial voids shrinkage faster as pressure increase. The time dependent morphology...
Whisker formation mechanism has been widely investigated for recent decades since its great influence on degrading the reliability of the electronic devices. In our work, effect of current stressing on whisker growth in Cu/Sn3.8Ag0.7Cu/Cu and Cu/Sn58Bi/Cu solder joints was investigated. Results show that after current stressing for a long time, many whiskers are observed in some local regions at the...
Alloying with a suitable amount of rare earth (RE) elements in Sn3.8Ag0.7Cu solder alloy has been reported to have beneficial effects on their physical and mechanical properties. However, large sized RE-Sn phases, when adding excessive RE elements, will precipitate in the matrix of the solder. It is interesting to note that RE-Sn phases, when exposed in air, will be oxidized and rapid tin whisker...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
Thermal fatigue and room temperature isothermal mechanical performance of various Pb-free and SnPb solder joints were examined. Various solder alloys doped with Ni (SN100C) and Mn (SAC105-Mn and SACM) were evaluated and compared to SAC105, SAC 205 SAC 305 and SAC 405 and eutectic SnPb alloys. Solder spheres ranging from 10 to 20 mils were reflowed on various printed circuit board (PCB) surface finishes...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
The effects of Cu orientation and stand-off-height on the microstructure and growth of IMCs in Cu/SnAgCu/Cu solder joints was investigated. Cu6Sn5 and Cu3Sn were the two key intermetallic compounds (IMCs) that formed at the interface. On (111) Cu substrate, prism-like Cu6Sn5 grains could be observed after reflowing at 250°C for 10s. On polycrystalline Cu substrate, only scallop-like Cu6Sn5 grains...
Whisker formation mechanism has been widely investigated for recent decades since its great influence on degrading the reliability of the electronic devices. In our work, effect of current stressing on whisker growth in Cu/Sn3.8Ag0.7Cu/Cu and Cu/Sn58Bi/Cu solder joints was investigated. Results show that after current stressing for a long time, many whiskers are observed in some local regions at the...
The appearance of IMCs on the Sn/Cu interface plays an important role in the joint reliability. Their growth behavior during solidification of multiple reflows was investigated. Compressed air was employed to blow away the residual liquid solder immediately after heating preservation so that the morphology corresponding to heating preservation would remain unaltered; and then by compared they with...
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