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Lead-free reflow soldering techniques applying AuSn as well as SnAg electroplated bumps were chosen for the evaluation of the flip-chip-bonding process for X-ray pixel detectors. Both solders can be used in pick-and-place processes with a subsequent batch reflow suitable for high-volume production. AuSn solder was selected because of its fluxless bondability, good wettability, and self-alignment process...
For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal...
Stress-induced birefringence in silica-on-silicon waveguides is analyzed by the finite element method using the normalized plane strain model. The simulation results show that the thermal expansion coefficient of the upper-cladding is the most critical factor. A waveguide with zero birefringence is obtained and used to realize polarization independent AWGs.
In this paper, we present a novel electrical test structure for determining the thermal expansion coefficients (TECs) of micromachined polysilicon thin films. The electrothermal properties of the test structure are analyzed. The pull-in method is exploited in characterizing TECs of thin films. In addition, an analytical model and a measurement method are developed. The finite element software ANSYS...
The attachment of the silicon piezoresistive pressure sensor die to the substrate is one of the most critical steps in the production of highly accurate pressure sensor. In this paper, single parameter of the adhesive affecting the silicon piezoresistive pressure sensor's output characteristics has been studied. Shear strength of the adhesive with optimized parameters also has been evaluated. Material...
Anodic bonding between glass wafer and Si wafer are widely used for micro-electro-mechanical system (MEMS) device fabrication and packaging due to the good bonding quality. The residual stress in the bonding interface, which results from the different thermal expansion coefficients of the two wafer materials, is depended on the bonding temperature. In MEMS piezoresistive pressure sensor, the residual...
In this paper, a finite element numerical (FEM) simulation via COMSOL Multiphysics was carried out to study the performance of micro capacitive pressure sensor. At first stage, the effect of fabrication was considered. At second stage, calculating the relationship between capacitance and applied pressure under different operation condition, including bonding temperature, thermal expansion coefficient...
Interconnect technology is the key to the reliability of electronic devices. Electronic components are soldered to a printed circuit board (PCB). Major failure mode is thermal fatigue of solder joints since there is a big difference in the coefficient of thermal expansion (CTE) between soldered components. Underfill resin is used to improve the interconnect reliability. Resin can relief stresses in...
Since mechanical stress sometimes degrades both electronic functions and reliability of LSI chips, it is very important to control the residual stress in them to assure their highly reliable performance. The authors have already found that the distribution of the residual stress on a transistor formation surface of a chip changes significantly by changing the bump joint structure of packages or modules...
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