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“Acoustic angiography” is a super-harmonic contrast imaging technique, which is based on the fact that when excited with a moderate acoustic pressure near their resonance (2–4 MHz; around MI of 0.5–0.7) ultrasound contrast agents produce broadband content which extends well past 15 MHz. By detecting the higher order harmonic energy while transmitting at a low fundamental frequency, exquisite resolution...
A mode-matching (MM) formulation based on rectangular waveguide mode expansion is presented for the fast and accurate analysis of circular via hole rows in substrate integrated waveguide (SIW) filters. To ensure the full flexibility in positioning of the via holes this method is combined with the two-dimensional finite element method (2D FEM) without significant reduction in speed and accuracy. This...
This paper presents innovations and advances in demonstrating paper-thin organic packages with low warpage. These advances include: 1) Reduction in over-all substrate warpage, 2) Ultra-low stand off interconnection height, 3) Ultra-thin (30 μm core thickness) and ultra-low CTE (1–5 ppm/°C) organic substrates, 4) Assembly of large die onto the ultra-thin substrate, and 5) Assembly to form advanced...
In this paper we will demonstrate and present an analysis methodology to account for the processing parameters, particularly the manufacturing and processing of mold compound materials, to form flip chip packages on a substrate strip. The impact of manufacturing parameters such as pressure, temperature, shrinkage, and processing timing on strip warpage will all be considered and modeled. The commercial...
This paper presents a compact, single substrate, active substrate integrated waveguide (SIW) cavity backed patch antenna oscillator. In the last years, the fast development of wireless communications spurred a great demand for low profile antennas. Cavity backed antennas have been widely studied as they offer several design advantages such as increased efficiency due to surface wave suppression, and...
The transient process of filling the mold cavity in microelectronics packaging has been simulated applying the finite element method (FEM). The results have been compared to those of so-called dasiashort shotpsila experiments, in which the molding process is interrupted at predefined points in time. After determining the quantitative discrepancies between the simulation and the experimental results,...
Low expansion glass cavities with optically contacted mirrors can exhibit structural distortions at the mirrors which significantly shift the temperature at which dv/dT=0. An analytical analysis that incorporates finite element modeling is given.
A new concept of MEMS based thermoelectric power generator (TPG) is investigated in this study. By using solder based wafer bonding technology, we can bond three pieces of wafers to form vacuum packaged TPG. According to the finite element method and analytical modeling results, the output power per area of device is derived as 68.6 muW/cm2 for temperature difference of 6degC between two ends of thermocouple...
The effect of thinning down the chip thickness, will affect the stress pattern in the chip and causes the chip to deform locally when the thickness of the chip is thinner than a certain critical value. Such a local deformation may cause sharp gradient of residual stress around the solder bumps and thus, various failures. This paper shows that by considering the effect of solder bumps on a 50 mum chip,...
In order to predict warpage of chip-in-substrate package, finite element analysis was carried out with modeling layers in chip and substrate and effective thermoelastic properties. The effects of design parameters such as pattern on the gap between chip and cavity, number of circuit layers, thickness and face direction of the chip, and gap width were investigated. The result shows that the warpage...
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