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Bonding front propagation driven by the work of adhesion is restricted by the air drag and mechanical deformation of wafers. Energy variation during room temperature bonding can influence the bonding initiation and front propagation dramatically. In order to evaluate the dissipated energy and elastic strain energy resulting from the air cushion and the wafer bow, both theoretical and finite element...
In this study, we investigated the effect of silane compound immersion time and post annealing temperature on the adhesion of electroless plating (ELP) Ni-P film on silicon wafer. The silane compound-modified surface was carefully analyzed by atomic force microscope (AFM), X-ray photoelectron spectroscopy (XPS) and water contact angle (WCA). It is evidenced that silane compound approaches self-assembly...
In this study, a novel polyvinyl alcohol-capped palladium colloids is synthesized and applied as the catalyst for electroless plating (ELP) of nickel-phosphorous (Ni-P) film on a silane compound-modified silicon surface. Analyzed by scanning electron microscopy, water contact angle and X-ray photoelectron spectroscopy, it is found that the interaction between PVA-Pd and amino groups on ETAS is the...
A metamaterial transfer printing method done by adhesion switching of viscoelastic stamp is presented. 3-D stack of heterogeneous material can be built at a desired position regardless of target substrate even on cheese.
3D packaging using through silicon via (TSV) technology is becoming important in the integrated circuit (IC) packaging industry. This paper reports the wetting behavior of polymer liquids in the insulation deposition process by spin coating. Two methods containing adding wetting agent into polymer liquid and coupling agent treatments to wafer surface were implemented to improve the wettability between...
A new No Clean Flux (NCFx) material for large die packages was formulated, which has good wettability for area array lead-free solder bumps of 20 × 20 mm dies, and which doesn't leave any liquid residues under the die. In a reliability study on large die modules with a copper lid as a heat spreader, we confirmed no failures of electrical insulation during thermal and humidity tests. However, significant...
In this study, failure analysis was conducted to investigate the root cause of Ti/Ni/Ag film peeling from Si wafer surface. The adhesion strength of Ti/Ni/Ag film on Si was quantitatively measured by 4 Point Bending method (4PB), where a novel delamination initiation method was introduced to significantly reduce the energy barrier for the delamination initiation. The possible contamination elements...
In this paper, we have proposed and demonstrated a simple and low-cost fabrication technique to pattern carbon nanotube (CNT) film on PDMS which is useful for flexible sensors and electronics. We demonstrated the CNT patterning on the flat PDMS surface using standard photolithography method. The proposed technique produces a CNT film on PDMS with high flexibility and good conductivity. The resulting...
Stiction during device operation remains one of the mechanisms leading to permanent failure of operating silicon-based MEMS devices (MicroElectroMechanical Systems). The goal of this work was to investigate, whether stiction between parallel, smooth silicon surfaces can be decreased by thin inorganic films grown by atomic layer deposition (ALD). Test structures based on the cantilever-beam-array (CBA)...
Nanoimprint lithography (NIL) has proven to be an exceptional lithographic technique for nanoscale features. The elimination of the adhesion of the imprinted polymer to the imprinter upon withdrawal of the imprinter is crucial for a reliable transfer of the nanoscale pattern. Previous work on thick (>100 nm) diamond-like carbon (DLC) layers indicates fluorinated diamond-like carbon (F-DLC) provides...
Cu and Ti films were deposited by sputtering on thermally oxidized Si wafers and then the deposited films were bonded by direct Cu-Cu thermo-compression bonding for evaluating the effect of the wet pre-treatment on the interfacial adhesion energy. The interfacial adhesion energy was evaluated as 0.29, 1.28, 1.64, 1.17, and 0.42 J/m2 by acetic acid pretreatment at 35degC for 0, 1, 5, 10, and 15 min...
Parylene-C has been used extensively in neural interface devices as a conformal, biocompatible coating; it has also recently become an integrated part of our parylene-cabled silicon probes. However, it is found over the years that its adhesion capability to silicon may be compromised after thermal treatments, cleaning, handling, bench testing and implantations. This paper explores extensively new...
In this paper, wafer-to-wafer AuSi eutectic bonding was investigated and evaluated with various sets of experimental parameters. Single crystalline Si and amorphous Si were bonded with different dimension Au layers and observed by optical measurements. Material composition, adhesion layer, electrical insulation, bonding parameters, and surface pre-treatments were discussed and have improved bonding...
Summary form only given: In the study, an atmospheric-pressure plasma-induced grafting (APPG) has been developed to induce surface modification change on adhesion of polyethylene terephthalate (PET) surface and silicone. The Argon plasma was generated by a RF power under atmospheric-pressure. The most significant feature (APPG) of the process developed in this study was to induce chemical grafting...
dasiaBlack Siliconpsila can be used as mechanical bond interface alike a Velcroreg strapworking at any temperature without additional adhesives. An experimental setup and a method for a pulsating load is shown. Experiments have proven cycle numbers of 1 million and more at 80% of the static strength. This indicates that there is no fatigue, creeping or defect propagation effect.
A technique to coat three dimensional surfaces with silicon nanowires was used to create test devices to characterize the adhesion of microspheres to a model of the human intestine with the end goal of increasing bioavailability in drug delivery. Results indicate negligible toxicity and significant improvements in adhesion over conventional technologies.
In this paper, wafer bonding using Parylene as the adhesive layer is investigated. The experiments are carried out under various conditions in two approaches: Parylene-to-Parylene and Parylene-to-Silicon. By heating at 230??C and applying a bonding force in vacuum environment, both Parylene-Parylene and Parylene-Silicon are successfully bonded. The bonding quality is characterized by the joint area...
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