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The article presented research results of stressed and strained state of sensitive element of MEMS sensor depending on the pressure applied. A code for the ANSYS system was developed allowing to automate the process of constructing a solid model of pressure sensor and stressed and deformed state, taking into account technological features of their production. As a result of the program processing...
MEMS are systems of small size, light weight, enhanced performance and reliability finding widest of applications in sectors of Automotive, instrumentation and environment area, especially in aspects of weather monitoring and forecast. Nowadays it has become common for scientist and engineers working in micro-electro mechanical system area to simulate the structure using simulation software like COMSOL...
In this paper, influences of the initial stress on the surface micromachining silicon nitride pressure sensor was analyzed and discussed. The residual stress in the diaphragm is a major issue that makes significant difference on the performance of surface micro machined pressure sensors, such as warpage, micro-cracking, delamination, debonding, and nonuniform stress profile of the membrane. The pressure...
In this paper, influences of the initial stress on the surface micromachining silicon nitride pressure sensor was analyzed and discussed. The residual stress in the diaphragm is a major issue that makes significant difference on the performance of surface micro machined pressure sensors, such as warpage, micro-cracking, delamination, debonding, and nonuniform stress profile of the membrane. The pressure...
This paper aims to examine the feasibility of a novel resonant pressure sensor, which is realized by introducing a double-ended tuning fork (DETF) quartz resonator into a silicon substrate. Theoretical model and finite element simulation results are given to provide support for the scheme. Sensor prototypes are fabricated based on micromachining technologies. Experimental setup for testing is established...
The application of MEMS to the measurement of pressure is a mature application of micromachined silicon mechanical sensors. The present paper describes the design and simulation of surface micromachined piezo resistive type pressure sensor for enhanced sensitivity. The principle of the sensing mechanism is based on the deflection of sensing silicon nitride diaphragm. In order to achieve better sensor...
The effect of dihedral angles in the junction region of tensoresistive layer to contact pads on strain distribution in mesa-piezoresistor body was studied using the finite element method. Influence of mesa-piezoresistor geometry on its sensitivity was demonstrated.
The impact of singularity points on stress distribution in piezoresistive module is investigated by means of FEM simulation. The strong influence of singularities on stress distribution in silicon-glass interface is presented in this paper.
A structure of TiN double resonant beams pressure sensor is presented, the pressure is measured through the relation between the resonant frequency of TiN resonant beams and the measured pressure. In this paper, the maths model of sensitive structures of the resonant sensor is established, through the analysis and numeration from the theory, and simulation by the ANSYS software, the varied extension...
The impact of singularity points on stress distribution in piezoresistive module is investigated by means of FEM simulation. Strong influence of singularities on stress distribution in silicon-glass interface is presented in this paper.
This paper describes the design, microfabrication and characterization of a CMOS compatible multi-terminal pressure sensor (MTPS). This sensor is an alternative to the pressure sensors based on the conventional silicon Wheatstone piezoresistive bridge (WB) or four-terminal piezotransducers. The layout of the MTPS is designed in such a way that the sensor sensitivity is effectively improved and the...
Mechanical stress is increasingly applied in micro-electronics. For instance, strained silicon technology is widely used to improve carrier mobility and therefore driver current for advanced MOS transistors. For micro-electromechanical systems, piezoresistive effects are universally employed in pressure sensors. In this paper we present an original method for studying mechanical stress in nano-devices...
This study presents a silicon-based micro-pressure sensor in which the piezoresistive patches on the polysilicon membrane are configured in the form of two concentric Wheatstone bridge circuits. The sensors in the central circuit measure the membrane deflection caused by the combined effects of the pressure and the ambient temperature, respectively, while those in the outer circuit measure the deflection...
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