The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Through Silicon Via (TSV) is a very attractive solution for 3D stacking. One of the main concerns regarding the TSV technologies is the resulting stress build up inside the silicon substrate that induces warpage or expansion at the wafer level, crystalline defects in the neighboring silicon of the TSV and finally can impact performances and reliability of CMOS device as well. In this work, we show...
Interfacial delamination is one of the primary concerns in electronic package design. Pop-corning in plastic-encapsulated IC packages is a defect frequently occurring during the solder reflow due to moisture penetration into the packages. Moisture absorption has a detrimental effect on the EMC/Cu interfacial adhesion and drastically reduces the reliability of the encapsulated package. To obtain good...
3-D technologies open a wide range of chip integration possibilities for microelectronic systems. Most of these technologies are using through-silicon vias (TSV). One disadvantage of this technology is the high investment for new equipment and processing cost for Si etching and metallization. The thin chip integration technology (TCI) presented in this paper is based upon existing WLP infrastrcuture:...
This paper presents a novel interconnect technology and packaging solution for silicon power devices, along with the virtual prototyping tool created to develop the concept and optimize it in terms of reliability. The technology is based on the use of bumps (i.e., conductive spheres or cylinders) to connect the surface of vertical power components and is characterized, in comparison with standard...
The drop reliability of mobile electronic products has become a major concern recently. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased the stress during drop impact due to their complicate structure. In this study, evaluation and prediction of the drop reliability for SIP was performed using modeling techniques. 3D-dynamic nonlinear finite...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.