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Summary form only given. Accompanying of MEMS sensor using in consumer production widely, system in package (SiP) technology becomes popular to integrate CMOS device (such as ASIC or DSP) with MEMS sensor together. It is excellent to connect sensor to signal amplifier directly to deduce RC delay and board level noise. However, with CMOS technology evolution to 0.13um or 90nm, the thermal stability...
A thin film solid state cooler for COB direct assembly using supperlattice based thermoelectric material is reported. The embedded cooler attached between the die chip and metal plate can provide site-specific cooling as well as active on-demand cooling. This demonstration offers the possibility of thin film active cooling for the COB direct assembly. The high power density of chip-on-board would...
Flipchip Technology is getting more and more important for future packaging solutions. This presentation gives an overview of different Flipchip Technology Solutions provided by industry. Mainstream Technologies such as C4 and ACF / ACP processes are explained. In special focus will be recently developed new processes to improve: Thermosonic Gold to Gold Interconnect (GGI) Process and Encapsulant...
To reduce the thermal stresses generated in COB interconnection using NCF and flip-chip metallic bumps in conventional high-temperature processes, a surface activated bonding method is used in this study. The bonding feasibility is confirmed at 100-150degC in ambient air using Ar-RF plasma pretreatment under low vacuum. The surface conditions before and after activation are analyzed by X-ray photoelectron...
Chip-On-Film (COF) packaging is an attractive solution for the direct attachment of chips onto a polyimide (PI) substrate patterned with copper leads. However, despite its many advantages, the eutectic Au-Sn alloy formed in the high temperature bonding process has a number of unsolved reliability issues. Accordingly, the current study performs a series of experiments to investigate the heat dissipation...
We demonstrate a micromachined flexible chip-to-board chip interconnect structure for a chip scale package. Micromachined flexible interconnects enable robust operation in high thermal cycling environments, even for high pinout chips due to the flexible interconnect ability to absorb thermal expansion strain. The interconnects on the chip-side and printed wiring board (PWB)-side are united by electroplating...
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