The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Non-collapsible Cu-Sn bumps (Cu pillars capped with a thin layer of Sn) have been studied recently as a means to vertically interconnect device layers, achieving 3D integrated circuits. The use of Cu-Sn bump structures is attractive for 3D integration for two primary reasons: 1) the rigid nature of the Cu bump allows for very fine pitch interconnections to be made with less risk of bridging than would...
Because of downsizing of electronic products and cost effectiveness, rigid substrate-flexible substrate (RS-FS) bonding technology using ACFs becomes more important as an alternative to socket type connectors and rigid/flex substrates. However, formation of process related bubbles, entrapped inside the ACF layer during bonding processes, is strongly influenced by process variables, such as a bonding...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.