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Abstract form only given. One of the big challenges today for the electronic packaging industry is to implement lead free solder replacing Pb-Sn solder alloy. This impacts the entire electronic manufacturing industry, from component supplier to equipment manufacturer. Though the industry has identified possible alternates to Sn/Pb solder alloy, much work still needs to be done, especially in the area...
The following topics are dealt with: flip chip; drop/impact reliability; innovated interconnects and processes; nanotechnology; electrical systems; lead free solders; advanced substrates; advanced packages reliability; wafer level and 3D interconnects; shock, vibration and transient bending; flip chip underfills and encapsulants; integrated RF components; wafer level packaging; test and qualification...
Lead-free solder joint reliability in electronic packaging assemblies is a concern when the product is subject to thermal exposure. The intermetallic compound (IMC) growth in Sn3.8Ag0.7Cu(SAC)/ENIG and SAC/Cu-OSP solder joint at different thermal aging condition were reported in this study. The IMC growth behavior subjected to isothermal aging exposure at 125degC and thermal cycling with upper soak...
Usually the mechanical reliability of electronic packages is qualified by temperature cycle tests (TCT). However this is a more or less isothermal test, while in operating condition temperatures can have a non-uniform distribution, because thermal transient effects are present. This effect can play an important role in packages that generate heat, like the module with power amplifier that we studied...
In this paper, the response spectra analysis is introduced to obtain transient structural responses of an undamped multiple degrees of freedom structural system subjected to impact acceleration pulse of a half-sine waveform. The JEDEC drop test condition B is specifically chosen to investigate transient structural responses of a board-level test vehicle comprised of a test board and a mounted package...
To study the quantitative reliability of electronic packages, a finite element analysis, with the assumption that certain geometric parameters are random variables, is carried out for a flip-chip package. The maximum strain of the package subject to thermal-cyclic loading is obtained, and the fatigue life of the package is determined based on a modified Coffin-Manson equation. Both quantities derived...
The following topics are dealt with: system-in-package; signal integrity; drop impact modeling; bio-MEMS and accelerometer packaging; reliability test methods; advanced packaging; electrical characterization; advanced reliability modeling; MEMS packaging; radiofrequency components; radiofrequency modules; lead free materials; lead free packaging; optoelectronics; electrical modeling and simulation;...
This paper describes a study of solder joint reliability of a copper column (CuC) interconnect scheme in wafer level packages using a simulation-based design optimization methodology to investigate the effects of various design parameters on the solder joint thermo-mechanical reliability and to find the optimal parameter settings. Design of experiments (DoE), surrogate modeling and numerical optimization...
In this study, VQFN (very thin quad flat no lead) assembly with Sn-Ag-Cu lead-free solder and Ni/Au board finish was tested under three-point and four-point cyclic bend at room temperature (25degC) and high temperature (125degC). Correlation between three-point and four-point bend was performed. It was found that the cycle to failure increases significantly with displacement ranges decreasing for...
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