Search results for: Fa-Xing Che
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 11 > 1774 - 1785
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 2 > 298 - 306
Microelectronics Reliability > 2016 > 61 > C > 64-70
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 2 > 224 - 237
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 9 > 1273 - 1283
IEEE Transactions on Device and Materials Reliability > 2015 > 15 > 2 > 181 - 190
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 9 > 1432 - 1440
Materials Characterization > 2013 > 78 > Complete > 129-143
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 11 > 1960 - 1970
Journal of Electronic Materials > 2013 > 42 > 3 > 470-484
Microelectronics Reliability > 2012 > 52 > 11 > 2701-2708
Materials Science & Engineering A > 2012 > 551 > Complete > 160-168
Journal of Electronic Materials > 2012 > 41 > 9 > 2631-2658
Journal of Electronic Materials > 2012 > 41 > 8 > 2073-2082
Journal of Materials Science: Materials in Electronics > 2012 > 23 > 11 > 1988-1997
2008 10th Electronics Packaging Technology Conference > 1171 - 1177
IEEE Transactions on Device and Materials Reliability > 2008 > 8 > 3 > 455 - 463