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The contact resistance is the key variable that characterizes the stable performance and long-term service of an electrical connection. It is worth noting that the contact resistance in substation connectors can be several times that of the connector's resistance. To reduce connection losses and thus decrease connector's operating temperature, it is important to minimize contact resistance. The aim...
Insulation resistance measurement is one of the widely used methods to diagnose insulation conditions of turbine generators. Since insulation resistance tends to decrease with the increasing temperature, it needs to be evaluated on exactly the same basis. Insulation resistance of the epoxy-mica based insulation system does have temperature dependence in the temperature range over 40°C, but the insulation...
The channel temperature (Tch) and thermal resistance (Rth) of Ga2O3 metal-oxide-semiconductor field effect transistors were evaluated for the first time through electrical measurements complemented by device simulations that incorporated experimental Ga2O3 thermal parameters. The analysis technique was based on a comparison between DC and pulsed drain currents (IDS) at known applied drain biases (V...
Insulator-metal transitions (IMTs) are the subject of intense fundamental and applied research including their potential applications in electronic devices like coupled relaxation oscillators [1], neuromorphic devices [2], Phase FETs [3], and RF switches [4]. A key requirement for practical device application of IMT materials is that the IMT temperature (IWr) should be greater than 358 K (85C) which...
We demonstrate a W-band bolometer based on a platinum nano-strip which is integrated with a waveguide probe on a polymer substrate. We measure a high thermal response of 49000 K/W thanks to the small size of the Pt resistor and the thermal properties of the polymer. Furthermore, its small thermal capacity allows to decrease the time constant to 2.2 ms. A good matching in the entire W-band is achieved...
In power electronic devices, the winding temperature of the transformer in operation needs to be monitored in real time. But the Electromagnetic Interference(EMI) problems cause the measured winding temperature fluctuates anomalously. In this paper, the 10MVA transformer in the cabinet of a transformer rectifier is studied as a specific case, the temperature measurement circuit of the transformer...
Because of a rapid growth of worldwide energy consumption an economical use of power is a necessity to ensure the supply reliability. One key technology to realize sparing energy use is power electronics. The cost of power electronic devices became an important aspect in this application due to its broader use compared to the past. In recent years, high efficiency at a given lifetime with low system...
A multi-chip stacked package using through silicon-vias (TSVs) still has the reliability concerns due to tremendous number of TSVs and micro-bumps in the stacked chips. Cu-filled TSVs may bring about process-induced failures as copper protrusion or copper diffusion into silicon lattice. Micro-bumps have various failure modes such as non-wet, bump cracking, and head-in-pillow joints, which are obviously...
We explored the properties and performance of copper-based metallic nanoparticle paste (MNPs) for interconnects applications in 3D heterogeneous integration. A patterning method was developed to process micron sized sintered MNPs structures. This enables the fabrication of IC interconnect test structures to characterise specific resistivity sintered MNPs and the contact resistances of sintered MNP...
This paper presents a new test protocol aimed at accurately determining the temperature of 3D electronic circuits as well as their heat distribution. It is based on AC electrical measurements coupled with InfraRed Lock-In Thermography (IR LIT) measurements. The circuit temperature is assessed thanks to AC resistance measurements and the Temperature Coefficient of Resistance (TCR) of metallic layers...
The quasi-distributed sensor allowing measuring of steady-state temperature fields has been proposed. The sensor comprises of thin sensing resistive elements arranged in grid structure. The sensor can be used in the system wherein only external boundary is available for measurement equipment connection such as PEMFC membrane electrode assembly. The proposed sensor can be adapted to measure other physical...
This paper details the implementation of a virtual experiment (VE), which reproduces the current/voltage characteristics of a diode at two different temperatures. Unlike a simulation that exploits idealised generated data, the VE concept provides every student with a unique set of data, the quality of which is dependent upon the judgements they make. As such, the exercise is subject to exactly the...
Precise electronic thermometer (ET) with the data transfer by radio channel is developed. Original patented design, circuitry and program solutions are employed in ET. Measuring hardware-software complexes for the investigation and calibration of ET are developed on the basis of the National Instruments equipment with using of LabView software.
Until now, there has not yet been a standardized method for the LED module thermal resistance measurements. This directly affects the lifetime assessment of the LED modules. By testing and studying the temperature coefficient of the LED modules with different structures, it is found that the temperature coefficient of the LED module follows a linear relationship with voltage when an appropriate test...
The investigations presented in this paper illustrate the problem of modelling the average value of the convective heat transfer coefficient in the case of a free convection cooled power device with a heat sink. The total junction-to-ambient thermal resistance is dominated then by its component reflecting the heat exchange with the ambient at outer surfaces of the heat sink. Therefore, the proper...
Temperature measurement refers to the process of evaluating a current local temperature for immediate or later assessment. This research paper describes the design and development of circuit modules for lab experiments. Monitoring followed by controlling & maintaining the temperature of instruments/payloads flown in a spacecraft is very important application. Secondly, scientific laboratories...
Thermoelectric coupling finite element model of 150A/75mV shunt was established, and temperature rises of them when the measuring current was over range were analyzed. Electromagnetic finite element model of shunt was established, And electrodynamic forces on manganin sheets of shunt were analyzed. Then, the measurement errors were estimated according to the results of temperature rises and electrodynamic...
In article the experiments made with the measuring channel of temperature with automatic correction data conversion based on a method of sample signals are described. Analysis results of distribution laws and the value of the random component of the error are shown. The suggestions on application of multiple measurements for a decision on the introduction of a correction in the data conversion are...
In the field of power electronics the requirements in size, weight, reliability, durability and ambient temperature are driving the operational temperature beyond the limits of current die-attach technologies. Common bonding agents such as solder and high conducting adhesives are more and more replaced by silver pastes which are pressure assisted sintered at low temperatures. The silver pastes provide...
In this work, we present our first results on the suitability of electrically conductive adhesives for die-attachment of power devices. Commercial and prototype adhesives were tested with respect to their shear strength and mechanical reliability after temperature shock tests. Furthermore their electrical properties and thermal conductivity were tested and compared to SnAg soldered modules. For these...
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