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Different vacuum interrupters (VI) are equipped with Transversal Magnetic Field (TMF) contacts. Due to the current path, a transversal directed Lorentz-force is affecting the electric arc to move in a circular, in order to reduce the heat input and therefore the local erosion of the contact surface. The degree of the contact erosion is dependent on the local temperature of the arc root, which can...
Three dimensional chip stacking benefits from thermally conductive intra-stack bondlines. Accurately determining the thermal conductivity of percolating thermal underfill (PTU) layers, made up of dielectric filler particles and epoxy, is challenging due to their reduced dimensions. The constrained dimensions may also influence the effective composite material properties. This study investigates how...
Heat generation in integrated circuits has become in few decades one of the most limiting factors for performance improvement in mobile device components, such as cell phones or tablets. In these devices, heat dissipation is limited to a few Watts as state of art cooling systems, such as heat-sinks or fans, do not fit with the dimensional and power consumption constraints. Amongst the solutions proposed...
A study and comparison of substrates with ceramic and organic electrically insulating and thermally conductive layers for power electronic packages is presented. Reference is made to the “die on leadframe”-technology, to compare these structures with a commercial ceramic substrate. The focus of the study is on the thermal properties of the structures. Furthermore, a comprehensive overview of test...
Recent experiments have given closer insight into the temperature and pressure profiles of copper vapor arcs in simple geometries. It is of great importance to be able to understand the measured data by comparing it to simulations on similarly simplified configurations. We present simulation results and discuss possible comparisons.
This paper deals with the system design, technology and test of a novel concept of integrating silicon power dies along with thermo-electric coolers and a phase change heat buffer in order to thermally manage transients occurring during operation. The innovative power-electronics concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient...
The temperature-current rise in modern (up to 100–150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.
Manufacturers of power semiconductors and modules intend to rate the maximum junction temperature up to 200°C. This results in higher temperatures at other components of the inverter system as well. In this paper, it is presented a method to identify thermal constraints in an inverter design by combining analytical and numerical analysis of the thermal spreading. Furthermore, an overview of the thermal...
In the design of fault-tolerant or fail-safe systems, detailed knowledge of potential failure processes is required. One failure mode in electrical machines is an inter-turn, or turn-to-turn short-circuit, which can cause very large local heating and subsequently, progression of the fault. This paper experimentally determines the failure process and mode of enameled wire coils after occurrence of...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
In this paper, we present the experimental investigation of pool boiling heat transfer on multiscale (micro/nano) functionalized metallic surfaces. The multiscale structures were fabricated via a femtosecond laser surface process (FLSP) technique which forms mound-like microstructures covered by layers of nanoparticles. Using a pool boiling experimental setup with deionized water as the working fluid,...
Nanotwinned copper has been got widely attention in microelectronics because it simultaneously demonstrate high strength, high conductivity, superior thermal stability, which makes it a very promising candidate to replace the position of common copper in the next generation of IC and packaging materials. The redistribution layer, a key process of wafer level packaging, was tailored by pulse electrodeposited...
For the demand of high density input/output (I/O), fine-pitch, and low-k materials in copper column bump flip chip packages, Thermal Compression Bonding (TCB) with pre-applied Non Conductive Paste (NCP) has been developed in order to ensure manufacturing reliability. The narrow bonding process window of pre-applied NCP, short bonding time, and high bonding head temperature can cause low yield issues...
During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile during the soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though...
This paper presents Invensas' silicon interposer technology for heterogeneous chip integration. Various process module and integrated blocks were optimized for yield and high performance in the interposer. The modules under evaluation include TSV etch, barrier deposition, electrochemical plating, chemical mechanical polishing (CMP), temporary bonding, low temperature oxide (LTO) and low temperature...
Glass has been proposed to be an ideal material for interposers to address the limits of both organic and silicon, except for its poor thermal conductivity compared to silicon. This paper proposes to use large number of copper through package vias (TPVs) that can be fabricated at low cost to improve this shortcoming. We report on experimental fabrication and evaluation of the effect of copper TPVs...
Through silicon vias (TSVs) are regarded as one of the key enabling component to achieve three-dimensional (3D) integrated circuit (IC) functionality. In this paper, we present the investigation on TSV protrusion and stress at different annealing conditions tested by means of optical profiler and high efficiency micro-Raman microscopy. Finite element method is utilized to model and simulate the thermo-mechanical...
Measurement of air flows is an important task in many process monitoring systems. In applications like control of ventilation and air conditioning systems, robustness, ease of use, and cost are important issues calling for simple and effective sensor design. This paper investigates the use of commercial-off-the-shelf printed circuit board technologies for the fabrication of calorimetric flow sensors...
Temperature increment in high voltage copper conductors is one of the important parameters that needs to be monitored continuously. This is due to significant temperature rise in the conductor may lead to thermal breakdown, which consequently causing power outage. One of the factors affecting temperature rise in conductors is the applied voltage waveform. In this work, simulation of temperature increment...
In the framework of a collaboration, CRPP (Centre de Recherches en Physique des Plasmas) and WEKA AG have developed high-temperature superconductor (HTS) current leads for currents in the range of 3 to 30 kA, which are suitable for industrial fabrication. In the development project, two 10 kA HTS current leads, mainly distinguished by the design of the copper heat exchanger and the transition zone...
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