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The electronics industry trend is to offer products that are smaller, with more functionality, better performance and lower cost. Stacked chip scale packaging (CSP) is an innovative packaging technique that involves thinning silicon to enable multiple chips to be stacked in a package for integrated solution. Stacking memory chips and stacking memory and logic chips together are two typical approaches...
In today conventional technology, multi-chip packaging (MCP) technology has become more important and popular with the purpose to increase the density of the integrated electronic and processing power. However, increasing in processing speed and enhanced capabilities for high power chip design, thermal management in MCP has become more challenging in heat dissipation due to multiple heat sources....
CPU packages continue to undergo significant changes to keep pace with demands of high performance silicon to meet market needs. In the last decades or so, increasingly CPU performance and frequency levels couples with lower product cost have been driving new package technologies. This paper illustrates an approach in CPU package design optimization for performance improvement and package cost reduction...
The demand for high performance and robustness drive CPU to evolve from MHz to GHz and from single core to multi-core packages. This paper describes the changes in CPU packaging technology and its evolution in the past three decades.
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