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This paper describes the thermal characterization and power map methodology on chipset silicon die. The on-die power map affects the overall thermal gradient and heat spreading effect from the die to the package top, which in turns drives the cooling requirements needed to meet package cooling target. This paper demonstrates the power-thermal simulation with different power map resolution and examines...
Attempts have been made to alter the solidification microstructures of fiber reinforced aluminum composites by cooling the ends of the fibers extending out of the mold. Experimental observations indicate that cooling the extended ends of the reinforcement results in finer microstructures in the matrix and changes the nature of the interface. In this paper, numerical simulation is performed on a two-dimensional...
In order to improve the material properties of fiber-reinforced aluminum composites, experimental research has been carried out to create finer matrix microstructures and novel interfaces between aluminum matrix (A2014) and carbon fibers using a modified pressure infiltration technique. In this novel process the ends of the fibers extending outside the mold are cooled by using a variety of heat sinks...
The electronics industry trend is to offer products that are smaller, with more functionality, better performance and lower cost. Stacked chip scale packaging (CSP) is an innovative packaging technique that involves thinning silicon to enable multiple chips to be stacked in a package for integrated solution. Stacking memory chips and stacking memory and logic chips together are two typical approaches...
In today conventional technology, multi-chip packaging (MCP) technology has become more important and popular with the purpose to increase the density of the integrated electronic and processing power. However, increasing in processing speed and enhanced capabilities for high power chip design, thermal management in MCP has become more challenging in heat dissipation due to multiple heat sources....
CPU packages continue to undergo significant changes to keep pace with demands of high performance silicon to meet market needs. In the last decades or so, increasingly CPU performance and frequency levels couples with lower product cost have been driving new package technologies. This paper illustrates an approach in CPU package design optimization for performance improvement and package cost reduction...
The demand for high performance and robustness drive CPU to evolve from MHz to GHz and from single core to multi-core packages. This paper describes the changes in CPU packaging technology and its evolution in the past three decades.
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