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3-Dimentional (3D) X-ray imaging significantly increases the visibility of the bond wires and lead frame structures of the complicated integrated circuits (IC) packages, particularly for the less visible Copper (Cu) bond wires used in more recent IC devices. It has become a very useful and effective technique for detecting package related failures without going through the lengthy physical analysis...
This paper highlights systematic fault isolation approaches to identify back-end of line metal bridging through the combination of techniques such as photon emission, soft defect localization, laser voltage probing as well as combinational logic analysis, to successfully pin point a single metal layer for physical failure analysis, thus boosting the overall success rate and turnaround time.
This paper demonstrates integration non-destructive analysis tools solution of MEMS multi-bonding to inspect the fusion bonding interface and eutectic bonding interface to locate defect layers. This analytical study shows successful SAT (Scanning Acoustic Tomography) and IROM (Infrared Optical microscopy) inspection of MEMS multi-bonding single issue layer. The multi-bonding double layers were happened...
Photon Emission Microscopy is the most widely used mainstream defect isolation technique in failure analysis labs. It is easy to perform and has a fast turnaround time for results. However, interpreting a photon emission micrograph to postulate the suspected defect site accurately is challenging when there are multiple abnormal hotspots and driving nets involved. This is commonly encountered in dynamic...
The case study is focus on one of the assembly defect which is invisible during 1st level for analysis. Root-cause finding involved assessment until die level analysis.
In this paper, we studied the Al bondpad qualification methodologies and application in backend process optimization and improvement so as to provide good quality bondpads and wafers in wafer fabrication. The three Al bondpad qualification methodologies including OSAT, SLAT and Wafer Die Sawing Test were introduced and discussed.
Failure Analysis (FA) consists of fault verification, isolation, defect tracing, characterization and physical (elemental) analysis. It helps wafer fab to understand the root causes of low yield cases, drive the yield improvement activities. Due to the complexity of modern Integrated Circuits (ICs), defects causing the failure need more effort, a variety of FA tools to be identified. In this case,...
Being an advanced application of SEM based Nanoprobing tool, Electron Beam Current (EBC) is commonly applied for detecting test-key failure or LBIST scan failure. In this paper, EBC is employed with TIVA (Thermal Induced Voltage Alteration) to diagnose the chip level Pin high resistance failure related issue.
Software scan diagnosis has been the de facto approach to narrow down possible defect locations in logic circuits by virtue of its speed and effectiveness. However, this capability is not supported for all product yield engineering and custom electrical failure analysis is naturally relied on. By this approach, unless the defects are gross, fault localization of internal logical nodes can be challenging...
In wafer fabrication, it is important for analyst to be equipped with the mindset of deep dive towards uncovering the underlying “hidden and real” defect even after finding some anomaly that appears to be the root cause. This is critical as inexperience analyst may regards the 1st anomaly seen as the cause of the low yield issue and this will lead to wrong process fix by the process integration. In...
Electron beam absorbed current (EBAC) has been used to isolate defects in BEOL metal stacks. With the increasing layout complexity, metal signal lines often run over 100um area and over multiple metal stacks. This makes SEM inspections during polishing tedious, time consuming and easy to overlook the defect. With the EBAC technique, it often shows the entire routing of the signal line with additional...
The combined benefits of reduced package footprint, higher input/output capability, better power and ground distribution and reduced signal inductance has made the flip chip package technology a primary packaging solution for portable consumer electronics as well as commercial/industrial applications. The technology qualification step ensures the highest quality and reliability performance on devices...
Carbon particle is not able to be detected by X-ray, so it is always a challenge to find out the defect mode if caused by conductive carbon particle in package. A non-destructive, quick and precious fault localization method with lock-in thermography (LIT) was demonstrated and follow up physical analysis (PFA) was performed. Consequently, conductive carbon particle was confirmed as the root cause...
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