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Carbon particle is not able to be detected by X-ray, so it is always a challenge to find out the defect mode if caused by conductive carbon particle in package. A non-destructive, quick and precious fault localization method with lock-in thermography (LIT) was demonstrated and follow up physical analysis (PFA) was performed. Consequently, conductive carbon particle was confirmed as the root cause...
After HAST of WLCSP devices mounted on PCB, several short and leakage failures were observed. Non-destructive technique, lock-in thermography (LIT) was applied to localize the fault on PCB. Thereafter, physical failure analysis (PFA) was performed. It revealed solder contamination between the solder bumps of PCB as cause of the failures.
We present a fast and high-throughput sample preparation method for FA (failure analysis) of Cu pillar FCQFN package. Our method facilitates simultaneous decapsulation of multiple devices, and with reduced number of package decapsulation steps. Further, throughput-time (TPT) for sample preparation is reduced from 90 min to 30 min.
Potential commercial physicochemical pretreatment methods, NaOH/microwave and NaOH/ultrasound were developed, and the carbon-based sulfonated solid acid catalysts were prepared for furfural residues conversion into reducing sugars. After the two optimum pretreatments, both the content of cellulose increased (74.03%, 72.28%, respectively) and the content of hemicellulose (94.11%, 94.17% of removal...
Mach Zehnder type optical modulators with modified ridge structure on a coplanar waveguide traveling wave electrode are investigated by the use of finite element method and BPM CAD waveguide software. The two ends of conventional ridge structure added taped ridge structures is considered, the transmission loss is obviously reduced. It is shown that the device increased modified ridge structure can...
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