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The combined benefits of reduced package footprint, higher input/output capability, better power and ground distribution and reduced signal inductance has made the flip chip package technology a primary packaging solution for portable consumer electronics as well as commercial/industrial applications. The technology qualification step ensures the highest quality and reliability performance on devices...
Photoluminescence (PL) spectroscopy from 10K up to 300K was performed on ∼50Å and ∼120Å GaAs/AlGaAs multiple quantum wells (MQWs) grown on on-axis and off-axis GaAs substrates. An anomalous quenching of the integrated PL in the 80–200K region was observed for the on-axis substrate-grown samples. X-Ray diffractometry (XRD) showed no significant structural difference between the on- and off-axis samples...
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