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In this paper, an improved median filtering algorithm is proposed for the restoration of images that are highly corrupted by salt and pepper noise. The proposed algorithm (PA) replaces the noisy pixel with the median of the already processed pixel values of the selected window, in which all the pixels are noisy, by considering two complementary processing directions. It turns out that PA can efficiently...
In this paper, a BGA package having a ARM SoC chip is introduced, which has component-type embedded decoupling capacitors (decaps) for good power integrity performance of core power. To evaluate and confirm the impact of embedded decap on core PDN (power distribution network), two different packages were manufactured with and without the embedded decaps. The self impedances of system-level core PDN...
This paper presents a tri-modal asymmetric memory controller interface that achieves 12.8-Gbps single-ended (SE) signaling over stripline FR4 traces. The controller can be configured to communicate with commercially available GDDR5 and DDR3 memories at 6.4 and 1.6 Gbps, respectively, with no package change. The interface is equipped with a compact voltage-mode driver with 1-tap pre-emphasis,...
High-speed link design in a 3D package system poses unique challenges due to the fact that it provides limited visibility to signal quality and that supply noise induced jitter is large due to a poor power distribution network in a small form factor. This paper outlines a statistical link simulation flow to accurately capture the impact of timing jitter due to power supply noise in 3D systems. The...
System power integrity characterization for low-power high-speed memory interface in a 3D package system is a challenging task due to probing difficulties imposed by small form factor. In this paper, power integrity measurements including supply noise, PSIJ sensitivity and PDN impedance curve using on-chip noise generator and monitors are presented. On-chip measurement data are validated by off-chip...
Characterization of I/O channels in 3D package systems is quite challenging as it is difficult to observe signal quality. A traditional way of measuring each device in a component level does not capture complex interaction in 3D integration. Although a sense line can be designed to externally measure noise on power lines, it is not feasible for signal lines as it significantly alters the signal quality...
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