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A capacitively coupled probing circuit with a de-skewer, a low-pass filter and a weak-feedback receiver realize membrane-based wafer-level simultaneous testing robustly with more than 300 Kpin connections. Both the probe chip and 300 mm DUT-wafer are fabricated in 90 nm and the measured power consumption of RX core is 0.5 mW with BER of 10-12 at 1 Gb/s.
An LCP flex based interconnect and a mating area array connector are used to increase the bandwidth of the module based memory systems. Simulations show that data rates in the range of 6.4 Gbps to 16.0 Gbps are possible depending on the memory system configuration. Tested prototype memory systems confirmed simulation predicted data rates of 16 Gbps and 12.8 Gbps for flex interconnect lengths of 6"...
An LCP flex interconnect is used to bypass the core vias and balls of the memory controller package, the PTH vias and traces of the FR-4 motherboard and memory module, and the traditional through-hole or SMT DIMM connector. A mating two-piece pin-grid array connector that can accommodate 36 differential pair signals is used to interface the flex to the memory controller package. On the memory side,...
Using capacitively coupled signaling, the feasibility of implementing an electronic connector as short as 240 mum in height is demonstrated for the first time using 0.18 mum CMOS technology and 125 mum FR4 printed circuit boards (PCBs). Maximum data rate of 500 Mbps/pin and 3.6 Gbps/mm2 are measured with 670 muW/pin of power consumption even with large parasitic capacitance associated with the FR4...
An LCP flex based interconnect that significantly improves the interconnect density and supports data rates in the range of 10 to 16 Gbps is evaluated to enable future high bandwidth module based memory systems without requiring complex equalization techniques. A mating two-piece, low- profile, high density and small insertion force connector is developed for interfacing the flex to a flip-chip package...
In this paper we showed the signal degradation parts in high-speed channel of FB-DiMM system. And we also showed possible countermeasure. For the verification propose and also for establishing the precise modeling and simulation method, we compared measurement and simulation up to 9.6Gbps operation with test board. And we get good relation between them. After getting the calculated loss budget of...
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