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Computer aided design tools are an integral part of the design flow of modern electronic systems. However, lack of physical consistency of the models that are used in the simulation and optimization cycle can cause the design tools to slow down unpredictably or even fail. This tutorial provides a comprehensive analysis of this important topic, with emphasis on relevant properties of the macromodel...
High frequency modeling and simulation tools can be used to rapidly develop new packaging structures, yet the models must often be verified by comparison to broadband measurements. This tutorial will discuss some of the key issues involved in an accurate comparison of electromagnetic simulations with measurements. The important factors to consider include which measurement calibration method to use,...
For high speed links, it is essential to meet the voltage and timing margin to achieve the Bit-Error-Rate (BER) requirement. With ever increasing data rate and lower BER requirement, meeting the timing margin, or limiting the timing jitter, becomes more and more critical. This tutorial will analyze the major jitter components in high speed links; explain how these jitter components are generated from...
For high-speed signaling, differential channels are now commonly used because of the improved noise immunity and receiver sensitivity that can be achieved compared to the single-ended channels that had been widely used in electronic systems until recently. However, single-ended channels have the distinct advantage of only needing one signal trace per signal, which in a well-controlled impedance, low-noise...
The following topics are dealt with: electrical performance; electronic packaging; signal integrity; power integrity; high speed links; on-chip issues; and EM modeling.
An interconnection-ground structure used according to the ZXnoise method may be modeled using a (n 2)-conductor multiconductor transmission line (MTL) model. However, a (n+1)-conductor MTL model is used to design the link. We validate this design procedure.
A new method to extract via and trace model from given S-parameter data of PCB channels with symmetrical ends is presented. By applying stochastic optimization to two channels of different channel lengths, the two-port s-matrix of via and trace can be accurately determined by searching the multi-dimensional parameter space.
Through silicon via (TSV) is a promising vertical interconnection method to achieve a 3-dimensional integrated circuit (3D IC) system. However, high-speed digital signals suffer from severe distortions induced by TSV interconnects. In this paper, we propose a TSV equalizer using an ohmic contact on a double-sided silicon interposer to reduce the inter-symbol interference (ISI) of the TSV interconnects...
Enhanced data rate requires the management of the voltage and timing margins in eye diagrams. This lays a great emphasis on controlling SSN in the power supply network. Thus, the ability of the power delivery network to convey clean power has become more important. In this paper, a practical scheme using power transmission lines is presented. Several accompanying issues are addressed to enable this...
The use of deterministic techniques to evaluate the impact of simultaneous switching output (SSO) noise on the performance of modern highspeed systems with tight timing budget can be pessimistic. These can lead to conservative design, especially, in multi-gigabit systems with embedded coding or scrambling sublayer. To overcome the shortcomings of conventional methodologies, a statistical simulation...
We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various...
Power delivery network (PDN) design continues to be a major challenge because it demands a good portion of available silicon, package, and board routing resources. In this paper, we outline a frequency and time domain co-design flow that uses frequency domain results to construct time domain input vectors, resulting in a resonance aware time domain analyses flow that can highlight low and mid frequency...
This paper describes the design and characterization of a low power differential memory interface targeted for mobile applications. The initial design of the memory interface achieves 2.7 to 4.3 GB/s data bandwidth and consumes 3.3 mW/Gb/s at 4.3 GB/s operation. The design allows two x16 stacked dies to be fit into a 12 mm PoP package, achieving a 12.8GB/s aggregated data bandwidth based on 3.2 Gb/s...
This paper demonstrates and compares the power efficiency of a standard differential current mode driver operating over an FR-4 channel with an improved driver with pre-emphasis operating over a silicon carrier channel. The drivers were designed for a 45 nm process, and both achieved a bit error rate of 10-15 errors per bit while operating at 4 Gbps. The power of the improved driver was reduced to...
In this paper, we look at how the introduction of forward error correction (FEC) impacts system design in a high-speed I/O link. We present examples where coding gain maps to improvements in transmit swing, ADC precision, jitter tolerance and comparator offset tolerance.
In order to alleviate the problem of far-end crosstalk induced jitter, signaling techniques based on exploiting the orthogonal property of fundamental transmission modes of multiline system have been proposed, but so far there have been no reports on practical transceiver realization for systems other than for the ones with completely degenerate channels. In this paper, a DSP-based implementation...
Statistical link analysis has gained significant importance as high-speed interconnect designs require accurate bit error rate prediction with device jitter and noise. Currently available statistical analysis techniques focus on modeling of data channels and the impact of a clock channel is often ignored or primitively approximated using a simple receiver sampling distribution. Thus, it ignores any...
High-speed digital signals suffer from frequency-dependent losses on channels with degraded timing and voltage margin at the receiver. A hybrid equalization technique is proposed to compensate for the frequency-dependent loss. The proposed technique is achieved by combining a wide-band passive equalizer and a second-order high-pass active filter, and presents a noticeable improvement in timing jitter...
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