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Electronics industry is successfully transitioning into lead-free (LF) solders to comply with government regulations. There are many challenges associated with reliability life prediction for LF solders such as the selection of temperature cycle test methods, material compatibility issues, and reliability models. This paper focuses on investigating the effect of extended dwell time on LF reliability...
Modern semiconductor devices in many applications require a thermal solution to remove the heat away from the device and maintain a certain operating temperature. These thermal solutions typically use a heat sink and a thermal interface material (e.g. thermal grease) between the device and the heat sink. A compressive load is applied to reduce the thermal resistance of the interface and facilitate...
Actual field conditions that computer components such as microprocessors experience are different from the accelerated thermal cycling tests typically used to perform reliability assessment. Field conditions can include longer dwell times, different temperature ramp rates driven by power ON/OFF events, and temperature fluctuations during the power ON state due to workload patterns. Series of numerical...
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