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In this work, the MPSCR (modified PMOS with embedded SCR) structure have been verified in a 0.35-um 40-V CDMOS technology. The MPSCR structure with high ESD robustness has been clearly investigated by TLP instrument and TCAD simulator. By the simulation results, the modified P+ electrode layout of cathode side can enhance the turn-on efficiency of embedded SCR path, and avoid the current crowding...
ESD protection designs for smart power applications with lateral double-diffused MOS (LDMOS) transistor were proposed. With the proposed ESD detection circuits, the n-channel LDMOS can be quickly turned on to protect the output drivers during ESD stress. The proposed ESD protection circuits have been successfully verified in a 0.35-μm 5-V/40-V bipolar CMOS DMOS (BCD) process. In addition, the power-rail...
The dependence of device structures and layout parameters on ESD robustness of HV MOSFETs in high-voltage 40-V CMOS process has been investigated by device simulation and verified in silicon test chips. It was demonstrated that a new ESD protection structure with p-type SCR embedded into the HV PMOS has the highest ESD robustness in a given 40-V CMOS process.
The ESD robustness on different device structures and layout parameters of high-voltage (HV) NMOS has been investigated in 40-V CMOS process with silicon verification. It was demonstrated that a specific structure of HV n-type silicon controlled rectifier (HVNSCR) embedded into HV NMOS without N-drift implant in the drain region has the best ESD robustness. Moreover, due to the different current distributions...
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