Search results for: Dong Wu
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 5 > 703 - 711
2015 International 3D Systems Integration Conference (3DIC) > TS8.7.1 - TS8.7.5
IEEE Electron Device Letters > 2015 > 36 > 2 > 204 - 206
IEEE Transactions on Circuits and Systems I: Regular Papers > 2015 > 62 > 1 > 29 - 38
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2014 > 22 > 12 > 2629 - 2634
Microelectronic Engineering > 2013 > 104 > Complete > 12-17
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 8 > 1430 - 1438
IEEE Transactions on Electron Devices > 2013 > 60 > 4 > 1421 - 1426