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As chip makers move to advanced nodes and device geometries shrink, design and production costs have risen rapidly. As a result, it has become increasingly critical to reduce costs in established technology nodes by increasing device yield. For a given process, differences in individual process chambers can lead to process variations that may have a large impact on both overlay control and yield management...
As chip makers move to advanced nodes and device geometries shrink, design and production costs have risen rapidly. As a result, it has become increasingly critical to reduce costs in established technology nodes by increasing device yield. For a given process, differences in individual process chambers can lead to process variations that may have a large impact on both overlay control and yield management...
As semiconductor processes shift toward the 3rd dimension, lithography overlay and wafer topography control is becoming increasingly difficult, particularly at the wafer edge. Overlay is measured after lithography, thus cannot account for an increasing proportion of wafer-to-wafer displacement variability. For defocus, edge roll up/down contributes to regions where the wafer topography exceeds the...
In advanced lithography, controlling the overlay budget is one of the most critical requirements. For device nodes at 10nm and below, there are many process-based sources of surface displacement that contribute to the lithography overlay budget that are independent of the lithography process, i.e. etch, anneal, CMP, etc. By developing an understanding of how process-induced surface displacement impacts...
The improvement of device performance associated with the intentional manipulation of stresses on the transistor scale is an integral part of device fabrication at advanced technology nodes. However, comparatively little attention is given to stress management at within-die and within-wafer length scales. Process variations that occur on these longer length scales can induce significant within-wafer...
Silymarin, an extract from milk thistle (Silybum marianum), and its purified flavonolignans have been recently shown to inhibit hepatitis C virus (HCV) infection, both in vitro and in vivo. In the current study, we further characterized silymarin's antiviral actions. Silymarin had antiviral effects against hepatitis C virus cell culture (HCVcc) infection that included inhibition of virus entry, RNA...
Hepatitis C virus (HCV) infection is a major cause of liver disease. HCV associates with host apolipoproteins and enters hepatocytes through complex processes involving some combination of CD81, claudin-1, occludin, and scavenger receptor BI. Here we show that infectious HCV resembles very low density lipoprotein (VLDL) and that entry involves co-receptor function of the low-density lipoprotein receptor...
A wide variety of stimuli induce the inflammasome, but little is known about its role in immune protection against viruses. In this issue of Immunity, Allen et al. (2009) and Thomas et al. (2009) describe a critical role for NLRP3 induction of the inflammasome and protection against influenza virus infection.
The understanding and control of mechanical stresses accumulated during device fabrication is becoming more critical at advanced technology nodes. For example, e-SiGe is being used more and more extensively to strain the channel and improve PMOS performance. However, increases in Ge concentration result in increased susceptibility to strain relaxation and severe wafer deformation during advanced thermal...
There have been extensive experimental observations of changes in the apparent rate controlling creep parameters in studies on superplastic materials. The three most common explanations associated with these changes in the stress exponent, n, the activation energy Q and the inverse grain size exponent, p involve the effect of concurrent grain growth, the operation of a threshold stress or transitions...
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