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Fan-out wafer level packaging (FO-WLP) technology has lots of advantages of small form factor, higher I/O density, cost effective and high performance. However, wafer warpage is one big challenge during wafer process, which needs to be addressed for successful process integration. In this study, methodology to understand and reduce wafer warpage at different processes is presented in terms of geometry...
This paper introduces a new packaging concept that allows miniaturization of bio-fluidic package for micro and nanoparticle separation through dielectrophoresis (DEP). Leaf-shaped spacers were patterned at wafer level using a developmental bio-compatible photoresist through lithography processes, allowing better control of spacer profile and thickness. Interconnects were formed on ITO-coated glass...
There are five types of die attach materials with high melting point (>250°C) are evaluated in this study, these materials are high lead (Pb95.5Sn2Ag2.5) solder paste, Gold Tin (Au80Sn20) solder paste, pressure-less Silver (Ag) sintered paste, pressure type silver (P-Ag) sintered paste and Gold Germanium (Au88Ge12) perform solder. The reliability tests included high temperature storage (HTS) at...
As device technology is moving towards nano-IC technologies and consumer market are aggressively demands for the miniaturization of electronic products with more functionality [1], the requirement for small IC components has significantly increased, particularly on QFN (Quad Flat Non-leaded) packaging. Two major advantages of QFN over other leaded packages are (1) cost to manufacturer. Smaller, thinner...
In this study, Silver sintering material is being evaluated on different metal surfaces for high temperature storage and high temperature plus high pressure test up to 300°C/30kpsi. Three different type of Alumina based ceramic substrates (gold, silver and copper metal finishes) are used as test vehicle in this evaluation. Die attach material and process quality has been evaluated in terms of die...
Epoxy type encapsulation does not suffice in High Pressure High Temperature (HPHT) environment and hence is not suitable for harsh environment applications. In this work, alternative encapsulation methods exploring the use of thickened lid/base and a novel dome shaped cavity design would be discussed. Results show that such methods are viable and are possible alternatives for similar harsh environment...
The concept of Multichip module (MCM) packaging is popularized for evaluating prototypes of novel devices and materials in extreme environmental conditions. The packaging for these types of electronics must be mechanically well-built and the metallization must be low in thermal conductivity in order to prevent the heat transfer from the external environment to the protected device. Strong bonding...
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