This paper introduces a new packaging concept that allows miniaturization of bio-fluidic package for micro and nanoparticle separation through dielectrophoresis (DEP). Leaf-shaped spacers were patterned at wafer level using a developmental bio-compatible photoresist through lithography processes, allowing better control of spacer profile and thickness. Interconnects were formed on ITO-coated glass and then flip-chip bonded onto the patterned die. The developed test vehicle, measured 5mm × 5mm, has 9216 electrodes arranged within a total sensor area of 3 mm × 3 mm. Experiments using colloids showed that the test vehicle is able to trap the 15μm suspended beads onto the electrodes.