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We present the technology for very compact hybrid circuits with one water cooled LTCC substrate, Silicon Photomultipliers and ASICs for Positron Emission Tomography / Magnetic Resonance Tomography Applications. The SiPM modules with an area of 32.8 by 32.0 mm2 contain 12×12 SiPMs in a pitch of 2.5 mm2. The readout of the 144 channels is done by four highly specialized ASICs. The water cooling channels...
Packaging technology has to continuously evolve in order to keep pace with the demand for smaller and lighter products. One manifestation of this is the need to drastically reduce the size of flip-chip bumps and their pitch. To make things more challenging, the changes have to be mastered with new materials in response to lead-free legislation. At the same time the reliability of the electronic devices...
The ongoing trend to miniaturized electronics has induced many developments towards size reduction and increasing performance in electronic products. To meet these requirements the involved processes, materials and components in electronics production have to be enhanced for high performance and high reliability. Flip-chip technology is one technology of choice with potential for highest integration...
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