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This paper describes a byte alterable EEPROM with B4-HE (Back-Bias assisted Band-to-Band tunneling Hot-Electron injection) architecture employing three-transistor of AND-type unit cell for disturb-free operation. B4-EEPROM cell array has been fabricated using a 90nm flash process, and single-pulse program and erasure cycling has been confirmed up to one million, with keeping programming time of 10us...
A novel cylinder-type metal-insulator-metal (MIM) capacitor in porous low-k film (CAPL) is proposed for embedded DRAMs (eDRAMs). The CAPL removes long bypass-contacts (BCT) with high resistance, which have been used to connect transistors with Cu interconnects by way of the MIM capacitor layer. A key technical challenge for the CAPL integration is control of pore structure in the low-k film to avoid...
Anomalous NLDMOS behavior under ESD stresses is investigated. Negative MM test results show failures at low stress voltage and local distributions of destruction spots. TCAD simulations clarified that the reverse recovery current during the MM stress causes parasitic NPN turn-on and effectively lowers the trigger voltage (Vt1).
A 90 nm floating gate NOR B4-Flash memory with IF (F: minimum feature size) gate length cell has been investigated by using 64 Mbit test chip to evaluate the scalability of B4-Flash memory. 90 nm (=1F) gate length of memory cell is shortest in many NOR flash memories reported previously. Basic program and erase characteristics and robust program disturb immunity of B4-Flash memory utilizing NMOS select...
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