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This paper describes and compares two integration methods to structurally laminate and interconnect foil-based components with flexible polymeric substrates. The first method uses isotropic conductive adhesives (ICA) confined in laser-ablated through foil vias (TFV), while the second one uses an anisotropic conductive adhesive (ACA). Both procedures were successfully demonstrated by interconnecting...
Systems-in-foil technologies address the current need to manufacture low-cost, low-complexity and high-reliabiltiy large area organic electronics in the field of OLEDs, OPVs and sensors. For substrates with multiple layers of conductive tracks, there is a need to realize contact positions on either side of the foil. Unfortunately, typical interconnection solutions such as electroplating used in the...
This paper reports a study on the dynamics of foil-based functional component self-alignment onto patterned test substrates and its demonstration when integrating a flexible sensor onto a printed circuitry. We investigate the dependence of alignment time and final precision of stacking of mm- and cm-sized foil dies on a number of system parameters, such as amount of assembly medium dispensed on target...
All-printed, cost effective, smart electronic products are expected to be used in a wide range of applications and in large quantities in our society. The substrate material for these applications will be low cost materials like PEN or PET foils. For the functionality of the printed electronics product it often will still be required to integrate a Si chip. To keep the flexibility of the package and...
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