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Wafer level packages (WLP) and Quad flat no-lead (QFN) packages are both widely used in electronics assemblies. This is because they both provide good electrical and thermal performance and especially low cost as they are simple in the construction. In this paper, two designs of experiment (DoEs) have been constructed. The first DoE is employed to characterize the impact of the module reliability...
This paper presents the drop test reliability of 0.5 mm pitch lead-free chip scale packages (CSPs). Fifteen 0.5 mm pitch CSPs were assembled on a standard JEDEC drop reliability test board with Sn3.0Ag0.5Cu lead-free solder. Eight boards were edge-bonded with a UV-cured acrylic; eight boards were edge- bonded with a thermal-cured epoxy; and twelve boards were assembled without edge bonding. Half of...
Continued miniaturization in combination with increased performance of microelectronics has generated an urgent need for improved thermal management techniques in order to maintain reliability of systems and devices. Development of advanced thermal interface materials has been identified as crucial, absorbing a portion of the advancements necessary within packaging technology. In this paper we introduce...
A new thermal-fatigue life prediction equation for a plastic ball grid array (PBGA) package with 95.5wt%Sn4.0wt%Ag0.5wt%Cu lead-free solder balls is proposed in this investigation. The test vehicle consists of the PBGA package, a lead-free PCB, and a lead-free solder paste (95.5wt%Sn3.9wt%Ag0.6wt%Cu). The coefficients of the fatigue equation presented herein are determined by best fit of the test...
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