Search results for: Wen-Kun Yang
IEEE Transactions on Advanced Packaging > 2009 > 32 > 2 > 390 - 398
Microelectronics Reliability > 2008 > 48 > 8-9 > 1149-1154
IEEE Transactions on Advanced Packaging > 2009 > 32 > 2 > 390 - 398
Microelectronics Reliability > 2008 > 48 > 8-9 > 1149-1154