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This paper reports the use of internal electrostatic transduction to excite and detect the fifth bulk lateral mode of a 54 mum outer-diameter, 12 mum-wide, and 2.5 mum-thick poly-silicon ring resonator at 1.95 GHz, with a quality factor Q~8000 in room air. The resonator is fabricated on a quartz substrate to reduce electrical feedthrough. The transducer is a sandwich of 500 nm of electrically floating...
This paper reports the parallel internal electrostatic transduction of a laterally driven Lame-mode polysilicon resonator. This resonator is fabricated using a manufacturable double nanogap process that provides ultrathin high-aspect ratio lateral gaps. The transduction electrodes are optimally placed and oriented to maximize electromechanical transduction efficiency for the fundamental Lame mode...
Microfabrication technologies initially developed for integrated electronics have been successfully applied to batch-fabricate a wide variety of micromechanical structures for sensing, actuating, or signal-processing functions such as filters. By appropriately combining the deposition, etching, and lithography steps for microelectromechanical devices with those needed for microelectronic devices,...
This paper describes a microelectromechanical resonator interface to a nanomechanical structure. Our approach to microresonator-nanowire integration employs silicon nanowires as mechanical tuning elements, which perturb the frequency response of the resonator system. Two coupling configurations were designed and tested, the first with a nanowire beam coupled to the maximum displacement points of clamped-clamped...
This paper demonstrates an electrostatic transducer for lateral contour-mode resonators in which the transduction gaps are filled with a liquid dielectric (water) having much higher permittivity than air ( kappawater = 80.1). Aqueous transduction is more efficient than air-gap transduction (lower motional impedance) and has a higher frequency tuning range compared than solid-dielectric transduction...
This paper reports a novel method for heterogeneous integration by re-embedding diced chips into a carrier wafer. We rely on capillary forces to register embedded chips to their carrier with sub-micron accuracy, as well as on a novel sedimentation method to solidly seal the chips into the carrier. By creating a CMOS-clean reconstituted wafer ready for subsequent process steps, this approach enables...
This paper reports the characterization of poly-silicon-germanium disk resonators at frequencies ranging from 35 to 425MHz. The back-end-of-line process technology is based on Spacer definition of sub-100nm lateral gaps, and uses Aluminum as interconnect material for compatibility with advanced CMOS backend. Reported data are organized around transmission, temperature and stability characteristics,...
This paper presents the development of HiQLab, a simulation tool to compute the effect of damping in high frequency resonators. Existing simulation tools allow designers to compute resonant frequencies but few tools provide estimates of damping, which is crucial in evaluating the performance of such devices. In the current code, two damping mechanisms: thermoelastic damping and anchor loss, have been...
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