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The development of automotive electronics (AE) towards autonomous driving applications generates various challenges, in particular also on the reliable functionality. In various cases dedicated automotive grade components are lacking and consumer components have to be used instead, which hardly fulfil automotive standards. Some of the reliability challenges are therefore thermo-mechanical in nature...
A new measurement method for mechanical stresses with microscopic and sub-microscopic spatial resolution is presented. It bases on classical stress relief techniques in experimental mechanics, as for example the familiar hole drilling method. Applicability of the classic method for micro and nano size objects was achieved, using very local stress relief caused by ion milling inside commercial FIB...
Increasing demands on efficiency, reliability and sustainability of high power electronics combined with the accompanying need of suitable new materials, raise the necessity to not only reconsider common designs and design strategies, but also to shorten and minimize the associated work on re-design and optimisation. Virtual prototyping might be an appropriate solution to this task but needs a strong,...
Ensuring reliability of interfaces of dissimilar materials is one of the most critical design aspects of electronic assemblies. A study on the interface delamination phenomenon of different power packages was undertaken. Thermally induced stresses caused by the thermal mismatch between molding compound (MC), Si-die, and Cu- heatsink act as combined shear and normal loadings on the respective interfaces...
The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method...
The paper addresses the determination of the effects of time and temperature on strength and lifetime of structural polymer composites. For some time, this topic has already concerned the aerospace industry during their fatigue tests of light structures made of fiber reinforced polymer (FRP) under various loading modes. More recently, the issue has also become of great relevance to applications in...
The in-situ detection of failures in microelectronic packages in an experiment is still a big challenge. The reliability of most packages will be qualified by measuring the electrical resistance of daisy chain structures. The moment of failure in the electrical sig-nals or the changes in the resistance are used for reliability or lifetime estimations. But the correlation of electrical resistance in...
Recent studies revealed that there is no simple ldquodrop inrdquo solution for the lead-free replacement of SnPb joints, instead different Sn-based solders are advantageous for different use conditions, which can be dominated either by drop loading or by thermal cyclic loading in harsh use conditions. By way of high-speed shear testing reliability assessments of components during drop and shock events...
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