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In this paper, memory devices integrating a double layer of silicon nanocrystals (Si-ncs) as a trapping medium and a HfAlO-based control dielectrics are presented. We will show that the use of two stacked Si-nc layers significantly improves the memory window compared with the single Si-nc layer devices, without introducing anomalies on the charging dynamics. Then, we also evaluate the potential use...
Al incorporation in the High-κ/metal gate stack is studied for pMOS transistors application. Al is here incorporated before or after high-k deposition, or during the metal deposition. Using bevelled oxides and Internal photoemission (IPE), we discriminate and quantify the three key mechanisms shifting the effective metal workfunction WFMeff: (1) a dipole (up to ~1 eV!) build up at the SiO2/High-κ...
In this work, memory devices integrating a double layer of silicon nanocrystals as trapping medium and a high-k HfAlO-based control dielectric are presented. We will show that the use of two stacked Si-nc layers significantly improves the memory window compared to the single Si-nc layer devices, without introducing dispersions on the charging dynamics. Then, we also evaluate the potentiality of hybrid...
Multilevel metallization is a key process for the technology generations below 0.5μm. As the design rules are going smaller, the limits of the classical SOG Etch-Back process are reached in terms of process complexity and long distance planarization. The solution to this problem is to use a Chemical Mechanical Polishing technique for the dielectric planarization. In this paper, we will demonstrate...
This paper discusses the data retention properties of ONO interpolysilicon dielectrics. Several low thermal budget recipes of bottom oxide are compared to improve FLASH E2PROM cells shrinkage toward 64 Mb generation. Best results are obtained for LPCVD bottom oxide against chlorinated and dry ones.
Charge trapping and detrapping characteristics have been studied on thin Si3N4SiO2 stacked dielectric layers processed in an integrated vacuum system with separate modules for HF vapor etching, silicon thermal oxidation and Si3N4 low pressure chemical deposition. At low field, polarization effects are observed, together with residual conduction. A large current flows at higher fields (≫ 6MV.cm??1),...
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