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The relationship of mechanical properties and micro texture of electroplated copper thin films used for 3D interconnections was investigated using a SEM, and an EBSD method. As a result, it was found that the mechanical properties changed due to the change of the average grain size and the crystallinity of grains and grain boundaries.
The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to...
The degradation process of the crystallographic quality of copper thin films, which are used for interconnections and micro bumps for 3D integration, during electromigration and stress-induced migration tests is dominated by the diffusion along grain boundaries and the diffusion constant of copper varies drastically depending on the crystallinity of the films. The degradation process was visualized...
The degradation process of the crystallinity of electroplated copper thin films, which are used for interconnections and micro bumps for 3D integration, during electromigration and stress-induced migration tests was observed clearly by applying an EBSD method. The grain boundary diffusion was the main reason for the degradation of the crystallographic quality in both grain boundaries and grains. The...
The change of the crystallinity of grain boundaries of the electroplated copper thin films used for the various interconnections in electronic products was evaluated quantitatively by applying an electron back-scattering diffraction analysis. It was found that the crystallinity of the electroplated films varied drastically depending on the electroplating conditions such as the composition of solute,...
The mechanical and electrical properties of electroplated copper thin films were found to vary drastically depending on their electroplating conditions and thermal history after electroplating. The change of their microstructure was the main reason for the variation. The crystallinity of the micro texture was evaluated quantitatively by applying an electron back-scattering diffraction method.
In this study, the influence of composition of thin films on the interface integrity between a hafnium dioxide thin film and a gate electrode was investigated by using a quantum chemical molecular dynamics method. Effect of the fluctuation of the composition around the HfO2±x/metal interface on the formation of the interfacial layer was analyzed quantitatively. Post-oxidation annealing after deposition...
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