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Granulation is a decorative technique for metalwork where tiny granules are used. Recent discoveries in China confirmed that pure copper granulation was employed as early as the seventh century CE. However, the production techniques for copper granule are still unknown. Herein, a systematic study is carried out to produce pure copper granules by using “pouring method”, “heating method”, and “crucible...
Samples prepared for S EM imaging after Focused Ion Beam (FIB) milling often require staining or delineation on the cross section to distinguish the different layers/features of the device structure. Wet staining using Buffered Oxide Etch (BOE), is one of the most common and economical decoration methods. Since we tetching is difficult to control, artifacts such as copper void and film over-etch may...
Graphene and its derivatives (graphite, CNT) have very high conductivity and critical current density higher than 108 A/cm2, which can be utilized in interconnect applications. Theoretically, a doped graphene is predicted to have better performance than Cu as an interconnect conductor. However, the feasibility of graphene interconnect has not been experimentally examined systematically. In this paper,...
To identify the influence of copper ion on the aging rate of oil-paper insulation, accelerated thermal aging experiments on oil-paper insulation were designed and performed at two significant temperatures. A set of characteristic parameters, including dissolved gases, degree of polymerisation, furfural content, water content and acid number of oil, was tested. The experiments- results reveal that...
This paper presents a novel design of highly twistable tactile sensing array which will be as artificial skin for robot applications. The proposed artificial skin, which employ extendable spiral electrodes, are highly flexible and durable so that it can conform to more complex surfaces without damaging the skin structure and the metal interconnects on the sensing array. Polydimethylsiloxsane (PDMS)...
This paper presents the design, fabrication and measurement of a flexible 8 times 8 temperature and tactile sensing array which will be used as the artificial skin for robot applications. The temperature and pressure sensing elements are heterogeneously integrated on a flexible copper-PI film using micromachining techniques. The tactile sensing elements are fabricated by dispensing conductive polymer...
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